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ALP208

Onsemi

ALP208 by Onsemi

ALP208 by Onsemi is a 521x218 pixel display with dimensions of 43x37x3 mm. It operates b/w -10 °C to 60°C, making it suitable for various applications requiring a compact and high-resolution display such as portable devices and IoT gadgets.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,732 parts In-Stock

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Digiode

USA . 351 parts In-Stock

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351

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 603 parts In-Stock

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$0.133

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$0.127

603

$0.133

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$0.127

Northwest PG Solutions

USA . 1,428 parts In-Stock

1+ parts

$0.146

100+ parts

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$0.129

1,428

$0.146

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$0.129

TANS Electronics

Latvia . 4,841 parts In-Stock

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4,841

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SupplyDigital Components

Austria . 3,110 parts In-Stock

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Corphita

USA . 1,619 parts In-Stock

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Problanco Electronics

Mexico . 824 parts In-Stock

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824

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Kulean Microsystems

USA . 529 parts In-Stock

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UHIMA Technologies

Türkiye . 477 parts In-Stock

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Corohmni

South Africa . 221 parts In-Stock

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Overview

Elevate your visual experience with the ALP208 by Onsemi, a high-quality display solution that delivers crisp images and vibrant colors. Designed by a trusted manufacturer, this display offers unparalleled performance and reliability for a wide range of applications. Whether you're looking to enhance your gaming setup, upgrade your digital signage, or streamline your industrial processes, the ALP208 provides unmatched value, benefits, and advantages that will elevate your user experience to the next level. Experience the difference with the ALP208 today.

Feature Benefit Bullets

Horizontal Pixel Count: 521 Pixel

High pixel count ensures sharp and detailed images, making this display ideal for viewing high-resolution content.

Depth: 3 mm

Slim and compact design, perfect for space-constrained environments.

Maximum Operating Temperature: 60 °C

Wide temperature range ensures reliable performance even in high-temperature environments.

Height: 37 mm

Optimal height for easy viewing and comfortable usage.

Minimum Operating Temperature: -10 °C

Suitable for use in cold environments without affecting performance.

Viewing Area Length: 37 mm

Provides a clear and expansive viewing area for a better user experience.

Length: 43 mm

Compact size makes it easy to mount or place on any surface.

Viewing Area Height: 27 mm

Offers a balanced height for a comfortable viewing experience.

Pixel Count (Vertical): 218 Pixel

Combined with horizontal pixel count, provides a high-resolution display for crisp images.

Technical Specifications

Displays & Monitors ALP208 attributes and parameters. Explore more Displays & Monitors devices from Onsemi

Specs

Horizontal Pixel Count:

521 Pixel

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-10 Cel

Depth:

3 mm

Height:

37 mm

Length:

43 mm

Sub-Category:

Displays

Pixel Count (Vertical):

218 Pixel

Viewing Area Height:

27 mm

Viewing Area Length:

37 mm

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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