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ALP249FXX

Onsemi

ALP249FXX by Onsemi

ALP249FXX by Onsemi is a 881x228 pixel display with 1.7mm depth, ideal for applications requiring compact screens. With a temperature range of -10 to 60 °C and nominal voltage of 12V, it's suitable for portable devices and automotive displays due to its small size and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 765 parts In-Stock

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765

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Vyrian

USA . 714 parts In-Stock

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714

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 200 parts In-Stock

1+ parts

$0.224

100+ parts

-

1k+ parts

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10k+ parts

$0.215

200

$0.224

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$0.215

Northwest PG Solutions

USA . 159 parts In-Stock

1+ parts

$0.246

100+ parts

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1k+ parts

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$0.217

159

$0.246

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$0.217

SupplyDigital Components

Austria . 8,129 parts In-Stock

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8,129

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Kulean Microsystems

USA . 8,012 parts In-Stock

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8,012

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Problanco Electronics

Mexico . 7,679 parts In-Stock

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7,679

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TANS Electronics

Latvia . 4,403 parts In-Stock

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4,403

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UHIMA Technologies

Türkiye . 739 parts In-Stock

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739

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Corohmni

South Africa . 396 parts In-Stock

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396

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Corphita

USA . 187 parts In-Stock

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187

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Overview

Enhance your viewing experience with the ALP249FXX by Onsemi. As a leader in the industry, Onsemi ensures top-notch quality and reliability in all their products. The ALP249FXX is perfect for a wide range of applications in displays and monitors. With its sleek design and crystal-clear resolution, this product offers exceptional value and benefits to customers. Upgrade your visual display with the ALP249FXX and enjoy a whole new level of clarity and precision.

Feature Benefit Bullets

Horizontal Pixel Count: 881 Pixel

High pixel count provides sharp and detailed images, making the display visually pleasing and suitable for tasks requiring precise visuals.

Depth: 1.7 mm

Slim design with a low depth makes it suitable for applications where space is limited, such as in thin electronic devices or sleek design setups.

Maximum Operating Temperature: 60 °C

High maximum operating temperature ensures the display can function effectively even in warmer environments without overheating or malfunctioning.

Height: 47 mm

Moderate height provides a good balance between screen size and space efficiency, making it versatile for various setups and applications.

Minimum Operating Temperature: -10 °C

Low minimum operating temperature allows the display to remain operational even in cold conditions, ensuring reliable performance in diverse environments.

Viewing Area Length: 50 mm

Optimal viewing area length ensures users have sufficient space to view content comfortably, enhancing the overall user experience.

Nominal Supply Voltage: 12 V

Stable supply voltage of 12 V ensures consistent power delivery to the display, minimizing the risk of voltage fluctuations that could affect performance.

Length: 56.7 mm

Compact length makes the display easy to integrate into various devices or setups without taking up excessive space, allowing for versatile placement options.

Viewing Area Height: 37 mm

Adequate viewing area height offers a comfortable viewing experience, ensuring that content is displayed clearly and without compromise on visual quality.

Pixel Count (Vertical): 228 Pixel

Vertical pixel count contributes to the overall display resolution, allowing for detailed vertical content display and enhancing the overall image clarity.

Technical Specifications

Displays & Monitors ALP249FXX attributes and parameters. Explore more Displays & Monitors devices from Onsemi

Specs

Horizontal Pixel Count:

881 Pixel

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-10 Cel

Depth:

1.7 mm

Height:

47 mm

Length:

56.7 mm

Sub-Category:

Displays

Nominal Supply Voltage:

12 V

Pixel Count (Vertical):

228 Pixel

Viewing Area Height:

37 mm

Viewing Area Length:

50 mm

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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