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ALP210

Onsemi

ALP210 by Onsemi

ALP210 by Onsemi is a 557x234 pixel display with dimensions of 48x40x3 mm. It operates b/w -10 °C to 60°C, making it suitable for various applications requiring a compact and high-resolution display such as portable devices and IoT gadgets.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,374 parts In-Stock

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2,374

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Digiode

USA . 1,468 parts In-Stock

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1,468

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 6,820 parts In-Stock

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6,820

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Kulean Microsystems

USA . 4,719 parts In-Stock

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4,719

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SupplyDigital Components

Austria . 4,175 parts In-Stock

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4,175

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TANS Electronics

Latvia . 3,420 parts In-Stock

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3,420

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Northwest PG Solutions

USA . 700 parts In-Stock

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700

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Corohmni

South Africa . 147 parts In-Stock

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147

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Native Components

USA . 124 parts In-Stock

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124

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Corphita

USA . 114 parts In-Stock

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114

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UHIMA Technologies

Türkiye . 35 parts In-Stock

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35

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Overview

Elevate your visual experience with the ALP210 by Onsemi. Renowned for their high-quality displays and monitors, Onsemi delivers exceptional performance and reliability in every product. The ALP210 boasts sharp images and vibrant colors, making it perfect for a variety of applications. From gaming to professional use, this display offers unbeatable value and benefits. Enhance your viewing experience with the ALP210 and see the difference for yourself.

Feature Benefit Bullets

Horizontal Pixel Count: 557 Pixel

High pixel count ensures sharp and clear display of images and text on the screen.

Depth: 3 mm

Slim and sleek design, ideal for space-saving and modern aesthetics.

Maximum Operating Temperature: 60 °C

Allows for reliable performance even in high-temperature environments.

Height: 40 mm

Compact size that fits well in various setups and configurations.

Minimum Operating Temperature: -10 °C

Can withstand cold temperatures, making it suitable for a wide range of environments.

Viewing Area Length: 41 mm

Provides a decent viewing area for comfortable viewing experience.

Length: 48 mm

Moderate length makes it versatile for different mounting options and setups.

Viewing Area Height: 31 mm

Optimal height for easy viewing without straining the eyes.

Pixel Count (Vertical): 234 Pixel

Combined with high horizontal pixel count, ensures high-quality display output.

Technical Specifications

Displays & Monitors ALP210 attributes and parameters. Explore more Displays & Monitors devices from Onsemi

Specs

Horizontal Pixel Count:

557 Pixel

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-10 Cel

Depth:

3 mm

Height:

40 mm

Length:

48 mm

Sub-Category:

Displays

Pixel Count (Vertical):

234 Pixel

Viewing Area Height:

31 mm

Viewing Area Length:

41 mm

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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