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ALP239CCX

Onsemi

ALP239CCX by Onsemi

ALP239CCX by Onsemi is a 557x234 pixel display with dimensions of 48x42x5.5 mm. Operating b/w -10 °C to 60°C, it requires a nominal voltage of 12V. Ideal for applications requiring compact and high-resolution displays in various temperature conditions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,227 parts In-Stock

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Vyrian

USA . 1,755 parts In-Stock

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1,755

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 873 parts In-Stock

1+ parts

$12.458

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873

$12.458

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Northwest PG Solutions

USA . 2,044 parts In-Stock

1+ parts

$13.704

100+ parts

$12.333

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2,044

$13.704

$12.333

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SupplyDigital Components

Austria . 5,536 parts In-Stock

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5,536

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Kulean Microsystems

USA . 4,309 parts In-Stock

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4,309

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Problanco Electronics

Mexico . 3,203 parts In-Stock

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3,203

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TANS Electronics

Latvia . 1,519 parts In-Stock

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1,519

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Corohmni

South Africa . 369 parts In-Stock

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369

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UHIMA Technologies

Türkiye . 308 parts In-Stock

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308

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Corphita

USA . 207 parts In-Stock

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207

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Overview

Elevate your visual experience with the ALP239CCX by Onsemi. Known for their superior quality and innovation, Onsemi brings you a cutting-edge display solution that is perfect for a wide range of applications. With its sleek design and crystal-clear image quality, this display monitor offers unmatched value and benefits to customers looking for a reliable and high-performance product. Whether you're using it for digital signage, industrial applications, or consumer electronics, the ALP239CCX delivers exceptional performance and functionality, making it the ideal choice for all your display needs. Experience the difference with Onsemi's ALP239CCX today!

Feature Benefit Bullets

Horizontal Pixel Count: 557 Pixel

High pixel count ensures sharp and detailed images on the display, providing a clear and accurate viewing experience.

Depth: 5.5 mm

Slim and sleek design, making the display visually appealing and easy to integrate into various settings.

Maximum Operating Temperature: 60 °C

Wide operating temperature range allows the display to function efficiently in various environmental conditions without overheating.

Height: 42 mm

Optimal height that balances visibility and space-saving, making it versatile for different installation setups.

Minimum Operating Temperature: -10 °C

Can withstand low temperatures, ensuring the display continues to function properly even in cold environments.

Viewing Area Length: 41 mm

Generous viewing area length provides ample space for content display, enhancing user experience and visibility.

Nominal Supply Voltage: 12 V

Ideal supply voltage that ensures energy efficiency and compatibility with standard power sources.

Length: 48 mm

Compact length that facilitates easy placement and integration of the display in various devices or setups.

Viewing Area Height: 31 mm

Sufficient viewing area height for displaying content clearly and engagingly, catering to user preferences for visual experiences.

Pixel Count (Vertical): 234 Pixel

Combined with high horizontal pixel count, vertical pixel count enhances image clarity and detail for a superior display quality.

Technical Specifications

Displays & Monitors ALP239CCX attributes and parameters. Explore more Displays & Monitors devices from Onsemi

Specs

Horizontal Pixel Count:

557 Pixel

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-10 Cel

Depth:

5.5 mm

Height:

42 mm

Length:

48 mm

Sub-Category:

Displays

Nominal Supply Voltage:

12 V

Pixel Count (Vertical):

234 Pixel

Viewing Area Height:

31 mm

Viewing Area Length:

41 mm

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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