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74LVC244ADTR2G

Onsemi

74LVC244ADTR2G by Onsemi

74LVC244ADTR2G by Onsemi is a Bus Driver & Transceiver with 7.5 ns Propagation Delay, 3-STATE Output Characteristics, and 20 Terminals. It operates at a Nominal Voltage of 3.3V and is suitable for automotive applications due to its -40 to 125 °C operating temperature range. The package style is Small Outline, Thin Profile, Shrink Pitch making it ideal for compact designs.

Median Price

$0.127

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 112,125 parts In-Stock

1+ parts

-

100+ parts

$0.132

1k+ parts

$0.110

10k+ parts

$0.098

112,125

-

$0.132

$0.110

$0.098

Verical

USA . 95,900 parts In-Stock

1+ parts

-

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-

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$0.122

95,900

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-

-

$0.122

Distributors (In-Stock)

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Digiode

USA . 746 parts In-Stock

1+ parts

$0.103

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746

$0.103

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Vyrian

USA . 2,518 parts In-Stock

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2,518

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Distributors (Availability)

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Corphita

USA . 2,016 parts In-Stock

1+ parts

$0.097

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-

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2,016

$0.097

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-

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Corohmni

South Africa . 459 parts In-Stock

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$0.108

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459

$0.108

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Component Stockers USA

USA . 106,045 parts In-Stock

1+ parts

$0.110

100+ parts

$0.110

1k+ parts

$0.100

10k+ parts

$0.100

106,045

$0.110

$0.110

$0.100

$0.100

AZTECH Wire

Italy . 523 parts In-Stock

1+ parts

$18.130

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523

$18.130

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Continental Prestige Electronics

USA . 109,625 parts In-Stock

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$0.130

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109,625

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$0.130

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TANS Electronics

Latvia . 8,345 parts In-Stock

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SupplyDigital Components

Austria . 6,649 parts In-Stock

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Kulean Microsystems

USA . 2,801 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,331 parts In-Stock

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Northwest PG Solutions

USA . 264 parts In-Stock

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$3.769

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264

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$3.769

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Native Components

USA . 177 parts In-Stock

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$3.730

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177

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$3.730

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Microchip USA

USA . 177 parts In-Stock

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Problanco Electronics

Mexico . 122 parts In-Stock

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UHIMA Technologies

Türkiye . 12 parts In-Stock

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12

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Overview

Experience seamless data transmission with the 74LVC244ADTR2G by Onsemi, a top-of-the-line bus driver & transceiver designed to deliver reliable performance in a variety of applications. Onsemi's reputation for quality and innovation shines through in this product, offering customers exceptional value and benefits. With quick propagation delay, high output current, and a wide operating temperature range, this versatile component is the perfect solution for your electronic design needs. Trust Onsemi to provide cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and lightweight, ideal for use in automotive applications where weight is a concern.

Propagation Delay At Nominal Supply: 7.5 ns

Low propagation delay ensures quick signal transmission, making this product suitable for high-speed data transfer requirements.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard supply voltage of 3.3V ensures compatibility with a wide range of electronic systems and power sources.

No. of Bits: 4

Having 4 bits allows for a higher data transmission capacity, making this product suitable for applications that require handling multiple bits of data simultaneously.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and temperature fluctuation, increasing its reliability and longevity.

Output Characteristics: 3-STATE

The 3-state output allows for multiple driver control, making it versatile and suitable for various bus driver and transceiver applications.

Technology: CMOS

Using CMOS technology ensures low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers 74LVC244ADTR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.004 mA

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

15.8 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74LVC244ADTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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