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74LVC126ADR2G

Onsemi

74LVC126ADR2G by Onsemi

74LVC126ADR2G by Onsemi is a 4-function bus driver with 3-STATE output, operating at a supply voltage range of 1.2V to 3.6V. It features a propagation delay of 12.8ns and can withstand temperatures from -40 °C to 125°C, making it suitable for automotive applications requiring fast signal transmission in compact spaces.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 6,562 parts In-Stock

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Digiode

USA . 2,270 parts In-Stock

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AZTECH Wire

Italy . 1,087 parts In-Stock

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Kulean Microsystems

USA . 6,138 parts In-Stock

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TANS Electronics

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Problanco Electronics

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Northwest PG Solutions

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SupplyDigital Components

Austria . 1,473 parts In-Stock

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Corphita

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Native Components

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Corohmni

South Africa . 433 parts In-Stock

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Microchip USA

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UHIMA Technologies

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Overview

Elevate your electronic designs with the 74LVC126ADR2G by Onsemi, a top-tier manufacturer known for its quality and reliability. This bus driver and transceiver is perfect for a wide range of applications, offering customers unmatched value and benefits. With 4 functions packed into a compact small outline package, this device boasts a fast propagation delay of 12.8 ns and a wide temperature range of -40 to 125 °C. Trust Onsemi to deliver excellence in every component, enhancing the performance of your circuits effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the product, making it suitable for various environments and conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 4

Having multiple functions in one device, this bus driver & transceiver offers versatility and functionality in a compact package.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard supply voltage of 3.3V, ensuring compatibility with a wide range of systems and applications.

Propagation Delay (tpd): 12.8 ns

Low propagation delay time of 12.8 ns ensures quick signal transmission, reducing latency and improving overall performance.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures up to 125 °C, making it suitable for automotive and industrial applications.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance state, providing flexibility in controlling the output signals and minimizing interference.

Width: 3.9 mm

Compact width of 3.9 mm enables space-saving design and integration in tight spaces or densely populated PCBs.

Minimum Supply Voltage (Vsup): 1.2 V

Can operate at low supply voltage of 1.2V, ideal for energy-efficient and battery-powered applications.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive-grade standards, ensuring reliable performance in automotive applications with high temperature and vibration requirements.

Technical Specifications

Bus Driver & Transceivers 74LVC126ADR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Additional Features:

OPERATING SUPPLY VOLTAGE 1.65 TO 3.60

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

12.8 ns

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

74LVC126ADR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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