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74LVC02ADR2G

Onsemi

74LVC02ADR2G by Onsemi

74LVC02ADR2G by Onsemi is a CMOS Logic Gates IC with 4 functions and 2 inputs. It operates at a supply voltage range of 1.2V to 3.6V, offering a propagation delay of 10.1ns. Ideal for automotive applications due to its small outline package and wide temperature range from -40 °C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,630 parts In-Stock

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Digiode

USA . 1,350 parts In-Stock

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AZTECH Wire

Italy . 674 parts In-Stock

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$21.710

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674

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Native Components

USA . 26 parts In-Stock

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$27.680

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Northwest PG Solutions

USA . 837 parts In-Stock

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$30.448

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$27.403

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Component Stockers USA

USA . 757 parts In-Stock

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$99.990

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757

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SupplyDigital Components

Austria . 4,637 parts In-Stock

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TANS Electronics

Latvia . 4,627 parts In-Stock

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Problanco Electronics

Mexico . 1,665 parts In-Stock

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Corphita

USA . 1,208 parts In-Stock

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Kulean Microsystems

USA . 798 parts In-Stock

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UHIMA Technologies

Türkiye . 530 parts In-Stock

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Microchip USA

USA . 438 parts In-Stock

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Corohmni

South Africa . 98 parts In-Stock

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Overview

Enhance your electronic projects with the 74LVC02ADR2G logic gate from Onsemi. Known for their high-quality components, Onsemi delivers reliable products that meet industry standards. With applications in a wide range of industries, this logic gate provides efficient signal processing and control functions. Experience the value of improved performance and reliability with the 74LVC02ADR2G, offering customers the benefits of precision engineering and cutting-edge technology. Elevate your designs with this versatile logic gate from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and ensures the components within the package are well-protected, making it a reliable choice for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing production costs.

No. of Functions: 4

This logic gate can perform multiple functions, offering versatility and flexibility in circuit design.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage level, making it compatible with many existing systems and power sources.

Propagation Delay (tpd): 10.1 ns

Fast propagation delay ensures quick signal processing, ideal for high-speed applications and reducing latency.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive-grade temperature ranges, making it suitable for use in automotive electronics and other harsh environments.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the logic gate.

Technical Specifications

Logic Gates 74LVC02ADR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

OPERATING SUPPLY VOLTAGE 1.65 TO 3.6 V

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

10.1 ns

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

74LVC02ADR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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