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74LVC00ADTR2G

Onsemi

74LVC00ADTR2G by Onsemi

74LVC00ADTR2G by Onsemi is a CMOS Logic Gates IC with 4 functions and 2 inputs. It operates at a supply voltage range of 1.2V to 3.6V, offering a propagation delay of 9.7ns. Ideal for automotive applications due to its wide temperature range and small form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,298 parts In-Stock

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Digiode

USA . 1,357 parts In-Stock

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Native Components

USA . 263 parts In-Stock

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$1.606

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Northwest PG Solutions

USA . 1,505 parts In-Stock

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AZTECH Wire

Italy . 675 parts In-Stock

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$15.930

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Component Stockers USA

USA . 589 parts In-Stock

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$99.990

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Problanco Electronics

Mexico . 4,721 parts In-Stock

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Kulean Microsystems

USA . 4,139 parts In-Stock

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SupplyDigital Components

Austria . 4,006 parts In-Stock

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Corphita

USA . 2,438 parts In-Stock

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TANS Electronics

Latvia . 1,153 parts In-Stock

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UHIMA Technologies

Türkiye . 647 parts In-Stock

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Corohmni

South Africa . 360 parts In-Stock

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Microchip USA

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Overview

Enhance the functionality of your electronic devices with the 74LVC00ADTR2G by Onsemi, a high-quality logic gate designed to deliver superior performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this product offers a wide range of applications in various electronic systems. With its innovative design and advanced technology, this logic gate ensures efficient operation and seamless integration, providing customers with unparalleled value and benefits. Upgrade your projects with the 74LVC00ADTR2G and experience the advantages of top-notch quality and precision engineering.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for a variety of applications.

Surface Mount: YES

Easy integration into circuit boards, saving space and simplifying assembly.

No. of Functions: 4

Ability to perform multiple logic operations in a compact component.

Nominal Supply Voltage: 3.3V

Standard voltage level for compatibility with existing systems.

Propagation Delay: 9.7 ns

Fast operation for quick response times in logic processing.

Maximum Operating Temperature: 125 °C

Suitable for high-temperature environments, such as automotive applications.

Technology: CMOS

Low power consumption and high noise immunity for efficient operation.

Technical Specifications

Logic Gates 74LVC00ADTR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

OPERATING SUPPLY VOLTAGE 1.65 TO 3.6 V

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

9.7 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74LVC00ADTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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