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2N5638

Onsemi

2N5638 by Onsemi

2N5638 by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage. Ideal for SWITCHING applications, it has a Max Power Dissipation of 0.31W and Max Operating Temperature of 150 °C. With a Drain-Source On Resistance of 30Ω, it operates in DEPLETION MODE efficiently.

Median Price

$0.438

Lifecycle Status

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25

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1k+

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Component Electronics Inc.

Canada . 56 parts In-Stock

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TEDSS.com

USA . 5,620 parts In-Stock

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American Microsemiconductor Inc.

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Bristol Electronics

USA . 26,108 parts In-Stock

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R&J Components

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Dan-Mar Components

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Electronic Expediters

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Tech-Mark Corp

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MISTER SPROCKETS

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ZD Integrated Circuits Inc.

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Prism Electronics

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Connector Distribution Corp

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Right Parts Inc.

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Manotoh

Italy . 48 parts In-Stock

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Mil-Aero Solutions, Inc.

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Fibra_Brandt Electronic GMBH

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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LittleDiode

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Corohmni

South Africa . 273 parts In-Stock

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Ampacity Inc.

Singapore . 1,575 parts In-Stock

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Native Components

USA . 774 parts In-Stock

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Northwest PG Solutions

USA . 2,353 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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LOOK Integrated Logistics

Peru . 6,664 parts In-Stock

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Problanco Electronics

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Kulean Microsystems

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NIA Electronics

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Authorized Procurement Solutions

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Corphita

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Glotronic Ltd.

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Montano Global Distributors

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TANS Electronics

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UHIMA Technologies

Türkiye . 654 parts In-Stock

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Perfect Parts

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Overview

Enhance your electronic designs with the 2N5638 by Onsemi, a high-quality small signal Field Effect Transistor ideal for switching applications. Manufactured by Onsemi, a trusted industry leader known for their superior technology and reliability, this N-channel transistor offers exceptional performance and efficiency. With a minimum DS breakdown voltage of 30V and a maximum power dissipation of 0.31W, this transistor is perfect for a variety of applications. Experience the benefits of dependable operation and precise control with the 2N5638, delivering value and quality to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides good insulation and protection for the transistor, making it durable and reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility and faster switching speeds compared to P-channel FETs, making them suitable for high performance switching applications.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltages without breakdown, making it suitable for applications where voltage spikes may occur.

Operating Mode: DEPLETION MODE

Depletion mode FETs are normally ON without a gate voltage applied, allowing for easy control of the switching operation in certain applications.

Maximum Power Dissipation (Abs): 0.31 W

With a maximum power dissipation of 0.31W, this FET can handle moderate power levels without overheating, ensuring stable operation.

Maximum Operating Temperature: 150 °C

The maximum operating temperature of 150 °C allows this FET to be used in high temperature environments without compromising performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) 2N5638 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

30 V

Maximum Drain-Source On Resistance:

30 ohm

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

4 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-W3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

WIRE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

2N5638 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-00-528-8190, 5961005288190

NIIN

005288190

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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