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SC16C550BIA44

NXP Semiconductors

SC16C550BIA44 by NXP Semiconductors

SC16C550BIA44 by NXP Semiconductors is a Serial Communication Controller with 44 terminals, operating at 4.5-5.5V, supporting data rates up to 0.375 MBps. It has a max clock frequency of 48 MHz and operates in industrial temperature range (-40 to 85°C). Ideal for asynchronous communication protocols in various applications requiring reliable serial IO/communication control.

Median Price

$3.170

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

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Freelance Electronics

USA . 157 parts In-Stock

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$5.010

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$5.260

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$4.960

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Digiode

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Vyrian

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ComSIT Distribution GmbH

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ComSIT USA

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Anansix

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J2 Sourcing AB

Sweden . 5 parts In-Stock

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Bristol Electronics

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Netroflash

USA . 2,000 parts In-Stock

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AZTECH Wire

Italy . 641 parts In-Stock

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Ampacity Inc.

Singapore . 1,527 parts In-Stock

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One Stop Electronics

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Lixinc

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Corphita

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Overview

Elevate your communication capabilities with the SC16C550BIA44 by NXP Semiconductors. Crafted with precision and reliability, this Serial Communication Controller offers seamless data transmission at a lightning-fast speed of 0.375 MBps. Ideal for industrial applications, this chip carrier package is designed to withstand extreme temperatures and ensure optimal performance. Experience the value of efficient communication protocols, versatile terminal positions, and a wide voltage range of 4.5V to 5.5V. Upgrade your systems with NXP Semiconductors and unlock endless possibilities in connectivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures a strong and reliable package for the controller, making it suitable for various environmental conditions.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this controller can handle a wide range of power inputs, providing flexibility in system design.

Maximum Data Transfer Rate: 0.375 MBps

The high data transfer rate allows for quick and efficient communication between devices, enhancing overall system performance.

Maximum Clock Frequency: 48 MHz

The high clock frequency enables fast processing speeds, making the controller suitable for applications requiring real-time data processing.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this controller can withstand harsh operating conditions, ensuring reliable performance in rugged environments.

Technical Specifications

Serial Communication Controllers SC16C550BIA44 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 2.5V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

48 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.375 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.585 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.585 mm

Trade Compliance

SC16C550BIA44 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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