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NX3L1G3157GM,115

NXP Semiconductors

NX3L1G3157GM,115 by NXP Semiconductors

NX3L1G3157GM,115 by NXP Semiconductors is a SPDT switch with 6 terminals and 1.65V nominal voltage. With a max on-state resistance of 1.7 ohm, it operates in automotive-grade temperatures from -40 to 125 °C. Ideal for applications requiring fast switching times and high isolation levels.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Vyrian

USA . 545 parts In-Stock

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545

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Anansix

USA . 139 parts In-Stock

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139

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Digiode

USA . 132 parts In-Stock

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132

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,041 parts In-Stock

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$1.730

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$1.730

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Semicontronic

India . 703 parts In-Stock

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$2.500

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$2.438

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$2.425

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703

$2.500

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$2.425

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Ampacity Inc.

Singapore . 1,310 parts In-Stock

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$4.500

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One Stop Electronics

USA . 428 parts In-Stock

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$7.500

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428

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Microchip USA

USA . 161 parts In-Stock

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$7.889

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AZTECH Wire

Italy . 681 parts In-Stock

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$8.366

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Corohmni

South Africa . 336 parts In-Stock

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$22.251

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Kepictronics

USA . 7,874 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,722 parts In-Stock

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Corphita

USA . 3,809 parts In-Stock

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Lixinc

USA . 3,492 parts In-Stock

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UNI Independent Distributors

Spain . 3,228 parts In-Stock

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Continental Prestige Electronics

USA . 2,338 parts In-Stock

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Argo Parts USA

USA . 1,458 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Experience seamless and reliable performance with the NX3L1G3157GM,115 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers top-quality multiplexers & switches that are suitable for a wide range of applications. With a focus on innovation and efficiency, this product offers unparalleled value to customers by providing fast switching times, low on-state resistance, and high off-state isolation. Trust NXP Semiconductors to provide cutting-edge technology that meets your needs with precision and reliability.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount:

YES - Enables easy and efficient mounting onto PCBs, saving time and effort during assembly.

Package Shape:

RECTANGULAR - Allows for a compact design that can fit into tight spaces, making it versatile for a variety of applications.

Nominal Supply Voltage (Vsup):

1.65 V - Low operating voltage requirement allows for energy-efficient operation, reducing power consumption.

Power Supplies (V):

1.6/3.3 - Provides flexibility in power supply options, making it compatible with a wide range of systems.

No. of Terminals:

6 - Sufficient number of terminals for versatile connectivity options, enhancing compatibility with different circuits.

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE - Space-saving design that can be integrated into compact devices without compromising on performance.

Maximum Operating Temperature:

125 °C - High operating temperature range ensures reliable performance even in harsh environments.

Minimum Operating Temperature:

40 °C - Wide temperature range allows for operation in extreme cold conditions, making it suitable for various applications.

Terminal Finish:

Tin (Sn) - Provides a reliable and corrosion-resistant finish for the terminals, ensuring stable connections over time.

Terminal Position:

DUAL - Dual terminal position enhances flexibility in circuit design and allows for different connection configurations.

Maximum Seated Height:

0.5 mm - Low profile design ensures a minimal footprint, ideal for applications where space is limited.

Technical Specifications

Multiplexers & Switches NX3L1G3157GM,115 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

1.45 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Nominal Off-state Isolation:

90 dB

Nominal On-state Resistance Match:

.2 ohm

Maximum On-state Resistance (Ron):

1.7 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.6/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Maximum Switch-off Time:

30 ns

Maximum Switch-on Time:

52 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1 mm

Trade Compliance

NX3L1G3157GM,115 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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