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UJA1078TW/5V0,112

NXP Semiconductors

UJA1078TW/5V0,112 by NXP Semiconductors

UJA1078TW/5V0,112 by NXP is a CAN transceiver designed for automotive applications, operating b/w -40 °C and 125 °C. It features a compact 32-terminal package with a data rate of 1 Mbps and supports power supplies from 4.5V to 28V. Ideal for network interfaces in vehicles, it ensures reliable communication.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,821 parts In-Stock

1+ parts

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7,821

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Digiode

USA . 4,046 parts In-Stock

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4,046

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Anansix

USA . 2,211 parts In-Stock

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2,211

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 191 parts In-Stock

1+ parts

$3.830

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191

$3.830

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AZTECH Wire

Italy . 1,033 parts In-Stock

1+ parts

$10.190

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1,033

$10.190

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One Stop Electronics

USA . 988 parts In-Stock

1+ parts

$933.000

100+ parts

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988

$933.000

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UNI Independent Distributors

Spain . 6,774 parts In-Stock

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6,774

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Corphita

USA . 4,503 parts In-Stock

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4,503

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Overview

Unlock the potential of your automotive applications with the UJA1078TW/5V0,112 from NXP Semiconductors—a trusted leader in innovative technology. This advanced CAN transceiver offers unparalleled reliability and performance, ensuring seamless communication in even the most demanding environments. With superior temperature resilience and an ultra-compact design, it’s perfect for modern vehicles. Experience enhanced efficiency and robust connectivity that drive your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material contributes to the durability and reliability of the product, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern electronic systems, which is a significant advantage for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on PCBs, facilitating efficient layout and component arrangement.

Power Supplies (V): 4.5/28

This wide operating voltage range makes the product versatile and compatible with various power supply designs, enhancing its usability in multiple environments.

No. of Terminals: 32

With 32 terminals, the product can support a variety of connections and functions, enabling complex circuit designs and flexibility in applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design cater to modern electronics requiring slim components, thereby supporting high-density assembly.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature indicates the component can function in demanding environments, ideal for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product is designed to perform reliably in extreme cold environments, making it suitable for various climates.

Terminal Position: DUAL

Dual terminal positioning enhances connection reliability and provides flexibility for design implementation.

Temperature Grade: AUTOMOTIVE

Rated for automotive use, this component meets stringent industry standards, ensuring it can withstand rigorous conditions found in vehicle applications.

Terminal Form: GULL WING

The gull wing terminal form provides excellent solderability and mechanical strength, improving assembly efficiency and reliability.

Maximum Supply Current: 0.099 mA

A low maximum supply current ensures energy efficiency, making this product ideal for battery-operated devices and minimizing power consumption.

Telecom IC Type: CAN TRANSCEIVER

As a CAN transceiver, this product is specifically designed for reliable communication in automotive and industrial networks, enhancing system connectivity.

Terminal Pitch: 0.635 mm

The 0.635 mm terminal pitch optimizes space usage while still allowing for reliable connections, facilitating compact design.

Data Rate: 1 Mbps

With a data rate of 1 Mbps, this product supports efficient data transmission, making it suitable for fast-paced communication in networking applications.

Technical Specifications

Network Interfaces UJA1078TW/5V0,112 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G32

No. of Terminals:

32

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Network Interfaces

Maximum Supply Current:

.099 mA

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

UJA1078TW/5V0,112 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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