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UJA1078TW/3V3,118

NXP Semiconductors

UJA1078TW/3V3,118 by NXP Semiconductors

UJA1078TW/3V3,118 by NXP is a CAN transceiver designed for automotive applications, operating b/w -40 °C to 125 °C. It features a compact 32-terminal package with a data rate of 1 Mbps and supports power supplies from 4.5V to 28V. Ideal for network interfaces, it ensures reliable communication in vehicles.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,674 parts In-Stock

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6,674

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Anansix

USA . 2,414 parts In-Stock

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2,414

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Digiode

USA . 553 parts In-Stock

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553

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Distributors (Availability)

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AZTECH Wire

Italy . 347 parts In-Stock

1+ parts

$16.900

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347

$16.900

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Component Stockers USA

USA . 241 parts In-Stock

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$99.990

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241

$99.990

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One Stop Electronics

USA . 656 parts In-Stock

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$180.000

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656

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Microchip USA

USA . 5,040 parts In-Stock

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5,040

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QUARKTWIN TECHNOLOGY LTD

USA . 2,898 parts In-Stock

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2,898

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UNI Independent Distributors

Spain . 2,010 parts In-Stock

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2,010

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Corphita

USA . 910 parts In-Stock

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910

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Overview

Elevate your automotive networking with the UJA1078TW/3V3,118 from NXP Semiconductors. Crafted for reliability and performance in harsh conditions, this CAN transceiver ensures seamless communication between vehicle systems, enhancing safety and efficiency. With its compact design, it effortlessly fits into modern applications while delivering exceptional durability. Trust in NXP's legacy of innovation to empower your next project with unmatched quality and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making this product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and efficient use of space on printed circuit boards, enhancing overall device performance.

Package Shape: RECTANGULAR

The rectangular package shape is a standardized form factor, facilitating easier integration into designs and compatibility with existing layouts.

Power Supplies (V): 4.5/28

A wide power supply range (4.5V to 28V) allows for flexibility in various applications, enabling the use of this device in diverse environments.

No. of Terminals: 32

With 32 terminals, the device supports complex interconnections, making it capable of handling sophisticated signaling and functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design reduce footprint and weight, which is advantageous for compact electronic devices and automotive applications.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures reliability in high-temperature conditions, making it suitable for automotive and industrial environments.

Minimum Operating Temperature: -40 °C

The product can function in extreme cold, with a minimum operating temperature of -40 °C, ensuring performance in a wide range of climates.

Terminal Position: DUAL

The dual terminal position enhances connection flexibility, allowing for easier integration into different PCB layouts without complications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this temperature grade guarantees it meets the stringent requirements for reliability in vehicles.

Terminal Form: GULL WING

Gull wing terminals allow for easier soldering to the PCB, promoting better and more reliable electrical connections.

Maximum Supply Current: 0.099 mA

A low maximum supply current of 0.099 mA improves energy efficiency, making this device ideal for battery-operated applications.

Telecom IC Type: CAN TRANSCEIVER

Being a CAN transceiver makes this product well-suited for real-time control applications, common in automotive and industrial networks.

Terminal Pitch: 0.635 mm

The 0.635 mm terminal pitch allows for easy placement and soldering on tightly packed circuit boards, maximizing layout efficiency.

Data Rate: 1 Mbps

With a data rate of 1 Mbps, the device supports quick and reliable data transmission, which is critical for fast-paced applications.

Technical Specifications

Network Interfaces UJA1078TW/3V3,118 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G32

No. of Terminals:

32

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Network Interfaces

Maximum Supply Current:

.099 mA

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

UJA1078TW/3V3,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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