Loading...

UJA1078TW/3V3,112

NXP Semiconductors

UJA1078TW/3V3,112 by NXP Semiconductors

UJA1078TW/3V3,112 by NXP Semiconductors is a CAN transceiver designed for automotive applications. It operates b/w -40 °C to 125 °C with a data rate of 1 Mbps and supports power supplies from 4.5V to 28V. Its compact design features a thin profile with 32 gull-wing terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,878 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,878

-

-

-

-

Anansix

USA . 2,181 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,181

-

-

-

-

Digiode

USA . 1,842 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,842

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 43 parts In-Stock

1+ parts

$19.080

100+ parts

-

1k+ parts

-

10k+ parts

-

43

$19.080

-

-

-

One Stop Electronics

USA . 275 parts In-Stock

1+ parts

$73.000

100+ parts

-

1k+ parts

-

10k+ parts

-

275

$73.000

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 6,466 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,466

-

-

-

-

UNI Independent Distributors

Spain . 4,629 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,629

-

-

-

-

Corphita

USA . 4,546 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,546

-

-

-

-

Microchip USA

USA . 2,968 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,968

-

-

-

-

Overview

Elevate your automotive networking with the UJA1078TW/3V3,112 from NXP Semiconductors. Renowned for their commitment to excellence, NXP delivers unparalleled quality in this CAN transceiver, designed to withstand extreme temperatures while ensuring reliable communication. Experience seamless integration and low power consumption, empowering your vehicle's advanced systems with enhanced efficiency and performance. Trust in NXP for innovation that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it ideal for various applications.

Surface Mount: YES

Surface mount technology allows for smaller size and integration into compact designs, saving valuable space on circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape supports efficient layout and assembly, optimizing PCB design.

Power Supplies (V): 4.5/28

Wide voltage range provides versatility in power supply options, accommodating different system requirements.

No. of Terminals: 32

With 32 terminals, the product supports comprehensive connectivity and functionality for complex networks.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and small outline design facilitate integration into space-constrained applications, enhancing design flexibility.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the device to function in demanding environments, increasing reliability.

Minimum Operating Temperature: -40 °C

Operating in extreme low temperatures ensures functionality in harsh climates, making it suitable for automotive applications.

Terminal Position: DUAL

Dual terminal positioning enhances design versatility and can help simplify PCB layout.

Temperature Grade: AUTOMOTIVE

Automotive temperature grading indicates that this product meets stringent requirements for automotive applications, ensuring durability and reliability.

Terminal Form: GULL WING

Gull wing terminals provide a reliable connection and are easier to solder, improving manufacturing efficiency.

Maximum Supply Current: 0.099 mA

Low power consumption at a maximum supply current of 0.099 mA is advantageous for energy-efficient designs.

Telecom IC Type: CAN TRANSCEIVER

As a CAN transceiver, this product is ideal for automotive and industrial networking, supporting high-speed communication.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm allows for compact placement on PCBs without compromising connectivity.

Data Rate: 1 Mbps

The data rate of 1 Mbps supports efficient data transmission for automotive and industrial applications, ensuring fast and reliable communication.

Technical Specifications

Network Interfaces UJA1078TW/3V3,112 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G32

No. of Terminals:

32

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Network Interfaces

Maximum Supply Current:

.099 mA

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

UJA1078TW/3V3,112 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20