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UJA1078ATW/3V3,112

NXP Semiconductors

UJA1078ATW/3V3,112 by NXP Semiconductors

UJA1078ATW/3V3,112 by NXP is a robust CAN transceiver designed for automotive applications, operating b/w -40 °C to 125 °C. It features a compact 32-terminal package with a data rate of 1 Mbps and supports power supplies from 4.5V to 28V. Ideal for network interfaces, it meets AEC-Q100 standards for reliability.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,428 parts In-Stock

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4,428

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Digiode

USA . 925 parts In-Stock

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925

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Anansix

USA . 280 parts In-Stock

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280

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AZTECH Wire

Italy . 128 parts In-Stock

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$10.520

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128

$10.520

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One Stop Electronics

USA . 458 parts In-Stock

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$181.000

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458

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QUARKTWIN TECHNOLOGY LTD

USA . 13,277 parts In-Stock

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Microchip USA

USA . 11,145 parts In-Stock

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Corphita

USA . 3,240 parts In-Stock

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UNI Independent Distributors

Spain . 1,282 parts In-Stock

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Overview

Unlock unparalleled connectivity with the UJA1078ATW/3V3,112 from NXP Semiconductors—the trusted leader in high-performance network interfaces. Designed for automotive applications, this robust CAN transceiver delivers exceptional reliability in harsh conditions, ensuring seamless communication. With its compact design and superior temperature tolerance, you gain efficiency and peace of mind. Choose NXP for cutting-edge technology that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for smaller footprints on PCBs, enabling more compact designs.

Screening Level: AEC-Q100

This certification indicates suitability for automotive applications, ensuring high reliability and performance under harsh conditions.

Package Shape: RECTANGULAR

The rectangular shape facilitates easier integration into PCB layouts, optimizing space and assembly.

Power Supplies (V): 4.5/28

A wide range of power supply options enhances versatility, allowing it to be used in various applications.

No. of Terminals: 32

With 32 terminals, this component supports complex connectivity for advanced network interface applications.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This package style is ideal for weight-sensitive applications, facilitating efficient thermal management.

Maximum Operating Temperature: 125 °C

The ability to withstand high temperatures ensures reliable performance in demanding environments.

Minimum Operating Temperature: -40 °C

This wide temperature range guarantees functionality in extreme cold conditions, perfect for automotive use.

Terminal Finish: MATTE TIN

Matte tin finish offers good solderability and corrosion resistance, ensuring longevity and reliability.

Terminal Position: DUAL

Dual terminal positioning allows for flexible circuit design and interconnectivity options.

Maximum Seated Height: 1.1 mm

With a low seated height, this product is suitable for low-profile applications, saving valuable space.

Width: 6.1 mm

The compact width contributes to space-efficient designs in electronic systems.

Length: 11 mm

A short length further aids in efficient PCB design and layout, making the integration process easier.

Temperature Grade: AUTOMOTIVE

This grade ensures the component meets stringent automotive standards for reliability and safety.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improve the mechanical stability of the component.

Maximum Supply Current: 0.000099 mA

Ultra-low current draw enhances energy efficiency, making it ideal for low-power applications.

Telecom IC Type: CAN TRANSCEIVER

Being a CAN transceiver, this component supports robust communication in automotive and industrial applications.

Nominal Supply Voltage: 14 V

The 14V nominal supply voltage aligns well with automotive systems, ensuring compatibility and stability.

Terminal Pitch: 0.65 mm

The 0.65 mm pitch supports high-density designs, allowing more connections in smaller areas.

Data Rate: 1 Mbps

A data rate of 1 Mbps enables efficient communications in real-time applications, essential for modern network interfaces.

Technical Specifications

Network Interfaces UJA1078ATW/3V3,112 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

11 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.000099 mA

Nominal Supply Voltage:

14 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

UJA1078ATW/3V3,112 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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