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UJA1075TW/3V3,112

NXP Semiconductors

UJA1075TW/3V3,112 by NXP Semiconductors

UJA1075TW/3V3,112 by NXP Semiconductors is a CAN transceiver designed for automotive applications. It operates b/w 4.5-28V, supports -40 °C to 125 °C temp range, and features a compact 32-terminal gull-wing package. Ideal for network interfaces in vehicles.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,778 parts In-Stock

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Digiode

USA . 1,209 parts In-Stock

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Anansix

USA . 286 parts In-Stock

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286

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Microchip USA

USA . 115 parts In-Stock

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$3.558

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AZTECH Wire

Italy . 310 parts In-Stock

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$17.880

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310

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One Stop Electronics

USA . 1,082 parts In-Stock

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$464.000

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UNI Independent Distributors

Spain . 4,833 parts In-Stock

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Corphita

USA . 4,291 parts In-Stock

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Overview

Elevate your automotive communication with the UJA1075TW/3V3,112 from NXP Semiconductors. Renowned for their excellence and reliability, NXP delivers a robust CAN transceiver designed to excel in harsh environments while ensuring seamless network connectivity. With its compact design and impressive temperature resilience, this innovative solution enhances system performance, offering you unmatched value and longevity for all your automotive applications. Experience the difference that quality engineering brings!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material provides enhanced protection against environmental factors, ensuring long-term reliability in various conditions.

Surface Mount: YES

Surface mount capability allows for easier integration into modern circuit boards, enabling more compact designs and improved manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on PCBs, making it suitable for high-density applications.

Power Supplies (V): 4.5/28

A wide voltage supply range allows flexibility in design and compatibility with various systems, making it adaptable for different applications.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options, facilitating complex circuit designs and multiple functionalities.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile are ideal for space-constrained applications, enabling miniaturization of devices without compromising performance.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature rating ensures reliable performance in demanding thermal environments, making it suitable for automotive applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature guarantees functionality in extreme cold conditions, providing versatility across various climates.

Terminal Position: DUAL

Dual terminal positioning allows for better signal integrity and simplification in PCB layout, enhancing overall design efficiency.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive standards, this component is built for high-reliability applications, ensuring it can withstand the rigors of automotive environments.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and robust connections, contributing to the overall reliability of the device in electronic assemblies.

Maximum Supply Current: 0.098 mA

Low power consumption (max 0.098 mA) minimizes energy use, making it an efficient choice for battery-operated devices and reducing overall operating costs.

Telecom IC Type: CAN TRANSCEIVER

Being a CAN transceiver enables effective communication in automotive networks, supporting reliable data transmission and enhancing system performance.

Terminal Pitch: 0.635 mm

The 0.635 mm terminal pitch allows for efficient spacing on the PCB, ensuring compatibility with standard assembly processes and improving manufacturability.

Technical Specifications

Network Interfaces UJA1075TW/3V3,112 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

No. of Terminals:

32

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Sub-Category:

Network Interfaces

Maximum Supply Current:

.098 mA

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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