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TJA1145TK/FD

NXP Semiconductors

TJA1145TK/FD by NXP Semiconductors

NXP Semiconductors' TJA1145TK/FD is a 14-terminal interface IC with a supply voltage range of 4.5V to 5.5V, suitable for automotive applications due to AEC-Q100 screening. The chip carrier package has a low profile of 1mm and features surface mount technology, making it ideal for compact designs in automotive electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 22,680 parts In-Stock

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22,680

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ComSIT Distribution GmbH

Germany . 6,000 parts In-Stock

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J2 Sourcing AB

Sweden . 5,376 parts In-Stock

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Zilex Electronics Inc.

Canada . 3,940 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,461 parts In-Stock

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3,461

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Digiode

USA . 2,109 parts In-Stock

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Anansix

USA . 1,286 parts In-Stock

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Vyrian

USA . 701 parts In-Stock

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701

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Nova Conductors

Japan . 100 parts In-Stock

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100

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AGACORP

USA . 69 parts In-Stock

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Electronics Depot

USA . 22 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 149 parts In-Stock

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$10.946

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AZTECH Wire

Italy . 378 parts In-Stock

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$12.121

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378

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Semicontronic

India . 1,324 parts In-Stock

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$12.500

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$12.188

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$12.125

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Aztec Data Supply Inc.

USA . 2,341 parts In-Stock

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$13.340

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Ampacity Inc.

Singapore . 202 parts In-Stock

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$45.500

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One Stop Electronics

USA . 912 parts In-Stock

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$47.500

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912

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Lixinc

USA . 10,848 parts In-Stock

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Corphita

USA . 3,872 parts In-Stock

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UNI Independent Distributors

Spain . 3,557 parts In-Stock

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Continental Prestige Electronics

USA . 3,432 parts In-Stock

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Futuretech Components

Singapore . 2,934 parts In-Stock

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Argo Parts USA

USA . 723 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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500

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Upgrade your automotive electronics with the TJA1145TK/FD by NXP Semiconductors, a high-quality interface IC that offers superior performance and reliability. Designed for a wide range of applications, this chip carrier is perfect for automotive communication systems, providing seamless connectivity at a nominal supply voltage of 5V. With its advanced features and AEC-Q100 screening level, this product ensures optimal functionality and durability. Trust NXP Semiconductors to deliver top-notch solutions for your automotive technology needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and allows for a lightweight design, making this product a reliable choice.

Surface Mount: YES

Easy to install and perfect for compact designs, making this product suitable for space-constrained applications.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product is versatile and can handle a wide range of power sources.

Screening Level: AEC-Q100

This product meets automotive industry standards for reliability, ensuring high performance in harsh environments.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate into existing designs, offering convenience and flexibility.

No. of Terminals: 14

With a high number of terminals, this product allows for multiple connections and functionality options.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of these styles ensures efficient heat dissipation and space-saving design, making this product ideal for compact applications.

Minimum Supply Voltage: 4.5 V

With a low minimum supply voltage, this product is energy-efficient and suitable for a variety of power sources.

Terminal Position: DUAL

Dual terminal positions provide flexibility in installation and usage, making this product versatile and easy to work with.

Maximum Seated Height: 1 mm

With a low height profile, this product is space-efficient and suitable for applications with limited vertical space.

Width: 3 mm

The compact width of this product allows for easy integration into tight spaces, making it a practical choice for small-scale projects.

Length: 4.5 mm

The short length of this product offers a compact footprint, perfect for applications where space is limited.

Terminal Form: NO LEAD

Lead-free terminals provide environmental benefits and comply with regulations, making this product a sustainable choice.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources, making this product easy to incorporate into various systems.

Terminal Pitch: 0.65 mm

With a small terminal pitch, this product offers high-density connections, making it ideal for applications requiring multiple interfaces.

Interface IC Type: INTERFACE CIRCUIT

This product is designed specifically for interface circuit applications, providing efficient and reliable performance in such applications.

Technical Specifications

Other Function Interface ICs TJA1145TK/FD attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-N14

Length:

4.5 mm

No. of Functions:

1

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC14,.12X.18,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TJA1145TK/FD Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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