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TJA1145T/FD

NXP Semiconductors

TJA1145T/FD by NXP Semiconductors

TJA1145T/FD by NXP Semiconductors is a small outline interface circuit with 14 terminals. It operates at a nominal voltage of 5V and has a max supply voltage of 5.5V. This IC is commonly used in automotive applications due to its AEC-Q100 screening level.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Cyclops Electronics Ltd

UK . 19,178 parts In-Stock

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ComSIT Distribution GmbH

Germany . 10,886 parts In-Stock

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Flip Electronics

USA . 2,500 parts In-Stock

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Anansix

USA . 2,125 parts In-Stock

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Vyrian

USA . 1,570 parts In-Stock

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Bristol Electronics

USA . 1,067 parts In-Stock

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Digiode

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Nova Conductors

Japan . 15 parts In-Stock

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Semicontronic

India . 476 parts In-Stock

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$5.500

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$5.362

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$5.335

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$5.500

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Corohmni

South Africa . 27 parts In-Stock

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$10.035

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Aztec Data Supply Inc.

USA . 468 parts In-Stock

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$14.610

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AZTECH Wire

Italy . 603 parts In-Stock

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$19.595

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Ampacity Inc.

Singapore . 1,595 parts In-Stock

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$21.500

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One Stop Electronics

USA . 654 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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Futuretech Components

Singapore . 5,000 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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A-Z Elektronik GmbH

Germany . 3,133 parts In-Stock

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Continental Prestige Electronics

USA . 3,121 parts In-Stock

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Lixinc

USA . 2,943 parts In-Stock

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Argo Parts USA

USA . 1,151 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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Bastille Electronics

Australia . 750 parts In-Stock

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UNI Independent Distributors

Spain . 76 parts In-Stock

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Overview

Experience superior performance and reliability with the TJA1145T/FD by NXP Semiconductors. As a leader in semiconductor technology, NXP ensures only the highest quality products for its customers. The TJA1145T/FD belongs to the category of Other Function Interface ICs, offering a wide range of applications. This compact and versatile chip is designed to meet the stringent requirements of the automotive industry, making it perfect for advanced driver assistance systems and automotive gateways. With its surface mount capability and small outline package style, it delivers maximum convenience and integration. Trust NXP's expertise and choose the TJA1145T/FD for unbeatable value, superior benefits, and unmatched advantages.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - The plastic/epoxy packaging of this product provides durability and protection, making it suitable for various applications.

Surface Mount

YES - The surface mount feature allows for easy installation and space-saving on circuit boards, enhancing overall design efficiency.

Maximum Supply Voltage

5.5 V - With a maximum supply voltage of 5.5 V, this product is compatible with a wide range of power sources, increasing flexibility in usage scenarios.

No. of Functions

1 - Despite having only one function, this product excels in delivering a specific task efficiently and reliably.

Screening Level

AEC-Q100 - The AEC-Q100 screening level ensures that this product meets automotive industry standards, making it a reliable choice for automotive applications.

Package Shape

RECTANGULAR - The rectangular package shape provides ease of handling and installation, offering convenience during assembly processes.

No. of Terminals

14 - With 14 terminals, this product offers a sufficient number of connections for various input and output interfaces.

Package Style (Meter)

SMALL OUTLINE - The small outline package style allows for compact integration, which is ideal for space-constrained designs.

Minimum Supply Voltage

4.5 V - The minimum supply voltage requirement of 4.5 V ensures reliable operation even in lower voltage environments, increasing versatility.

Terminal Position

DUAL - The dual terminal position facilitates easy cable connections, reducing the risk of faulty connections and enhancing overall reliability.

Maximum Seated Height

1.75 mm - With a maximum seated height of 1.75 mm, this product offers a low profile, making it suitable for applications with limited vertical clearance.

Width

3.9 mm - The compact width of 3.9 mm ensures efficient utilization of space in circuit board designs, optimizing overall layout efficiency.

Length

8.65 mm - The length of 8.65 mm provides a compact footprint, allowing for efficient integration into various electronic systems.

Terminal Form

GULL WING - The gull wing terminal form enables easy soldering and secure connections, ensuring robust electrical connections.

Nominal Supply Voltage

5 V - With a nominal supply voltage of 5 V, this product is compatible with a wide range of standard power sources, offering flexibility in usage scenarios.

Terminal Pitch

1.27 mm - The 1.27 mm terminal pitch provides ample spacing between terminals, reducing the risk of short circuits and enhancing ease of use during assembly.

Interface IC Type

INTERFACE CIRCUIT - As an interface circuit, this product enables seamless communication between different components or systems, enhancing overall system interoperability.

Technical Specifications

Other Function Interface ICs TJA1145T/FD attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Functions:

1

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TJA1145T/FD Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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