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TJA1145T/FD,118

NXP Semiconductors

TJA1145T/FD,118 by NXP Semiconductors

NXP Semiconductors' TJA1145T/FD,118 is an AEC-Q100 rated interface IC with 14 terminals. It operates b/w -40 to 85 °C and supports supply voltage range of 4.5V to 5.5V. Ideal for automotive applications due to its small outline package and gull wing terminal form.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Anansix

USA . 2,063 parts In-Stock

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Nova Conductors

Japan . 650 parts In-Stock

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Vyrian

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Digiode

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One Stop Electronics

USA . 1,647 parts In-Stock

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AZTECH Wire

Italy . 567 parts In-Stock

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Corohmni

South Africa . 485 parts In-Stock

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Ampacity Inc.

Singapore . 388 parts In-Stock

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Semicontronic

India . 706 parts In-Stock

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$45.500

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$44.362

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$44.135

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Argo Parts USA

USA . 3,703 parts In-Stock

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Continental Prestige Electronics

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Corphita

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Overview

Elevate your automotive applications to the next level with the TJA1145T/FD,118 by NXP Semiconductors. This high-quality Interface IC offers unparalleled reliability and performance, ensuring seamless communication in a variety of systems. Designed with precision and expertise, this product is AEC-Q100 qualified, making it ideal for industrial environments. With its compact design and wide supply voltage range, the TJA1145T/FD,118 delivers exceptional value and efficiency to customers looking for top-notch solutions in their projects. Trust NXP Semiconductors to provide you with the best in interface circuit technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the IC.

Surface Mount: YES

Surface mount capability makes it easy to integrate into modern PCB designs.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, ensuring compatibility with various systems.

Screening Level: AEC-Q100

AEC-Q100 certification indicates high reliability and quality suitable for automotive applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and routing on the PCB.

No. of Terminals: 14

Sufficient number of terminals for connecting to other components in the system.

Package Style (Meter): SMALL OUTLINE

Small outline package saves space on the PCB and is ideal for compact designs.

Minimum Supply Voltage: 4.5 V

Supports a low minimum supply voltage for energy-efficient operation.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in extreme temperature conditions.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and connectivity.

Terminal Form: GULL WING

Gull wing terminals are easy to solder and ensure a strong mechanical connection.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage for consistent performance.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for high density PCB designs.

Interface IC Type: INTERFACE CIRCUIT

Interface circuit IC type provides versatile functionality for efficient communication between devices.

Technical Specifications

Other Function Interface ICs TJA1145T/FD,118 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TJA1145T/FD,118 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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