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TJA1145TK

NXP Semiconductors

TJA1145TK by NXP Semiconductors

NXP Semiconductors' TJA1145TK is a 14-terminal interface IC with a supply voltage range of 4.5V to 5.5V, suitable for automotive applications due to AEC-Q100 screening. The chip carrier package has a low profile of 1mm and terminal pitch of 0.65mm, making it ideal for compact designs requiring high reliability.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 252,000 parts In-Stock

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Chip Stock

USA . 100,000 parts In-Stock

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100,000

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Cyclops Electronics Ltd

UK . 24,000 parts In-Stock

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24,000

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Flip Electronics

USA . 5,800 parts In-Stock

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5,800

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Anansix

USA . 2,315 parts In-Stock

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2,315

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Vyrian

USA . 1,003 parts In-Stock

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Digiode

USA . 565 parts In-Stock

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565

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Nova Conductors

Japan . 60 parts In-Stock

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60

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Distributors (Availability)

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AZTECH Wire

Italy . 872 parts In-Stock

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$7.586

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872

$7.586

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Ampacity Inc.

Singapore . 153 parts In-Stock

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$11.500

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153

$11.500

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One Stop Electronics

USA . 982 parts In-Stock

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$20.500

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982

$20.500

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Semicontronic

India . 396 parts In-Stock

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$31.500

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$30.712

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$30.555

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396

$31.500

$30.712

$30.555

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Component Connect

USA . 240,000 parts In-Stock

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Perfect Parts

USA . 13,440 parts In-Stock

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Lixinc

USA . 6,188 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,000 parts In-Stock

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Continental Prestige Electronics

USA . 5,568 parts In-Stock

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Futuretech Components

Singapore . 5,000 parts In-Stock

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5,000

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Corphita

USA . 4,294 parts In-Stock

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Argo Parts USA

USA . 3,901 parts In-Stock

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UNI Independent Distributors

Spain . 3,190 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Enhance your automotive electronics with the TJA1145TK by NXP Semiconductors. Built with top-notch quality and expertise, this interface IC offers reliable performance and seamless integration. Whether you're looking to improve communication systems or enhance vehicle safety features, this product is your go-to solution. With its compact design and advanced technology, the TJA1145TK provides value and efficiency like no other. Upgrade your automotive applications today with NXP Semiconductors' cutting-edge innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body makes the product lightweight and durable.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on PCBs, saving time and space.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with various systems and applications.

Screening Level: AEC-Q100

The AEC-Q100 screening level indicates high reliability and quality standards, suitable for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact and space-saving design for efficient PCB layout.

No. of Terminals: 14

The 14 terminals offer versatile connectivity options and compatibility with different interface requirements.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and space-saving design.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage provides flexibility in power supply requirements and compatibility with a wide range of systems.

Terminal Position: DUAL

The dual terminal position allows for easy and secure connections, enhancing overall reliability.

Maximum Seated Height: 1 mm

The maximum seated height of 1 mm enables a low-profile design, ideal for compact electronic devices.

Width: 3 mm

The narrow width of 3 mm contributes to the overall compactness of the product, suitable for space-constrained applications.

Length: 4.5 mm

The length of 4.5 mm adds to the compact form factor of the product, making it suitable for small and portable devices.

Terminal Form: NO LEAD

The no-lead terminal form provides a reliable and solderless connection, simplifying assembly and improving durability.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V offers a standard operating range for compatibility with most electronic systems.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting and efficient use of PCB space.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit type, this product facilitates communication between different components and subsystems, making it essential for system integration.

Technical Specifications

Other Function Interface ICs TJA1145TK attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-N14

Length:

4.5 mm

No. of Functions:

1

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC14,.12X.18,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TJA1145TK Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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