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TJA1145ATK/FD

NXP Semiconductors

TJA1145ATK/FD by NXP Semiconductors

NXP Semiconductors' TJA1145ATK/FD is a CAN transceiver with 5 Mbps data rate, AEC-Q100 screening level, and 65 mA max supply current. Ideal for automotive applications due to its small outline package and low seated height of 1 mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 16,050 parts In-Stock

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16,050

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Digiode

USA . 2,659 parts In-Stock

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2,659

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Anansix

USA . 2,610 parts In-Stock

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2,610

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Nova Conductors

Japan . 600 parts In-Stock

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600

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Vyrian

USA . 346 parts In-Stock

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346

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 4,434 parts In-Stock

1+ parts

$6.950

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4,434

$6.950

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AZTECH Wire

Italy . 269 parts In-Stock

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$12.043

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269

$12.043

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Corohmni

South Africa . 629 parts In-Stock

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$16.724

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629

$16.724

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One Stop Electronics

USA . 1,521 parts In-Stock

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$376.000

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1,521

$376.000

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Semicontronic

India . 658 parts In-Stock

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$458.000

100+ parts

$446.550

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$444.260

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658

$458.000

$446.550

$444.260

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Ampacity Inc.

Singapore . 752 parts In-Stock

1+ parts

$540.000

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752

$540.000

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Argo Parts USA

USA . 3,721 parts In-Stock

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3,721

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Continental Prestige Electronics

USA . 3,230 parts In-Stock

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UNI Independent Distributors

Spain . 1,877 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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Corphita

USA . 538 parts In-Stock

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538

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A-Z Elektronik GmbH

Germany . 270 parts In-Stock

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270

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Lixinc

USA . 175 parts In-Stock

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175

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Advanced Electronics

New Zealand . 36 parts In-Stock

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36

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Overview

Discover the cutting-edge TJA1145ATK/FD by NXP Semiconductors, a top-quality CAN transceiver that delivers seamless networking solutions for various applications. Designed with precision and reliability in mind, this Network Interface offers unmatched performance and efficiency. Perfect for automotive, industrial, and communication systems, this product ensures optimal data transmission at high speeds. Elevate your projects with the value and benefits that only NXP Semiconductors can deliver. Experience innovation like never before with the TJA1145ATK/FD.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable construction, making it ideal for applications that require portability and reliability.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Screening Level: AEC-Q100

AEC-Q100 compliance ensures high reliability and quality standards, making it suitable for automotive applications where ruggedness and durability are essential.

Package Shape: RECTANGULAR

The rectangular shape offers efficient use of board space, making it convenient for densely populated PCB layouts.

No. of Terminals: 14

With 14 terminals, this product provides a versatile connectivity option for various applications, allowing for enhanced functionality and versatility.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile design make this product suitable for compact devices where space constraints are a concern.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit connections, enabling different configurations and better integration with other components.

Maximum Seated Height: 1 mm

The low seated height allows for a slim and compact design, making it suitable for applications where space-saving is crucial.

Width: 3 mm

The narrow width of 3 mm ensures compatibility with standard PCB layouts and facilitates easy integration into existing systems.

Length: 4.5 mm

The compact length of 4.5 mm contributes to the overall small form factor of the product, making it suitable for space-constrained applications.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead contamination and ensures environmentally friendly disposal, meeting modern regulatory requirements.

Maximum Supply Current: 65 mA

With a maximum supply current of 65 mA, this product offers efficient power consumption, making it suitable for energy-conscious applications.

Telecom IC Type: CAN TRANSCEIVER

The CAN transceiver type enables reliable communication in automotive and industrial networks, providing robust data transmission capabilities for critical applications.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with standard power sources, simplifying integration and reducing the need for additional voltage conversion circuitry.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm enables high-density PCB designs, allowing for more connections in a limited space and enhancing overall system performance.

Data Rate: 5 Mbps

With a data rate of 5 Mbps, this product offers high-speed communication capabilities, making it ideal for applications that require fast and reliable data transfer.

Technical Specifications

Network Interfaces TJA1145ATK/FD attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

5 Mbps

JESD-30 Code:

R-PDSO-N14

Length:

4.5 mm

No. of Functions:

1

No. of Terminals:

14

No. of Transceivers:

1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC14,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current:

65 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TJA1145ATK/FD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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