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TJA1041T/N,112

NXP Semiconductors

TJA1041T/N,112 by NXP Semiconductors

NXP Semiconductors' TJA1041T/N,112 is a 14-terminal network interface IC with a 5V supply voltage. It features a small outline package style and gull wing terminal form. Ideal for telecom applications requiring interface circuitry in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,634 parts In-Stock

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Digiode

USA . 843 parts In-Stock

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Anansix

USA . 683 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Microchip USA

USA . 318 parts In-Stock

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$2.176

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318

$2.176

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AZTECH Wire

Italy . 437 parts In-Stock

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$19.376

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437

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Component Stockers USA

USA . 375 parts In-Stock

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$99.990

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One Stop Electronics

USA . 698 parts In-Stock

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$272.000

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698

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Ampacity Inc.

Singapore . 474 parts In-Stock

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$785.000

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UNI Independent Distributors

Spain . 2,637 parts In-Stock

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Corphita

USA . 2,016 parts In-Stock

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2,016

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Aranea Global

USA . 2,000 parts In-Stock

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Overview

Unlock seamless communication with the TJA1041T/N,112 by NXP Semiconductors. As a leader in network interfaces, NXP guarantees unparalleled quality and reliability in every product. This compact and versatile device is perfect for a wide range of applications, providing unmatched value and performance for your projects. Say goodbye to connectivity issues with the TJA1041T/N,112 and experience the difference that NXP Semiconductors can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC material makes the product lightweight and durable, while EPOXY provides protection against environmental factors, making it suitable for various conditions.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on circuit boards, ensuring reliability in the connection.

No. of Terminals: 14

Having 14 terminals allows for multiple connections and functionalities, providing flexibility in use.

Terminal Finish: TIN LEAD

TIN LEAD finish on terminals ensures good conductivity and reliable connections for efficient data transfer.

Maximum Seated Height: 1.75 mm

Low seated height enables compact design and saves space in electronic devices, making it suitable for small form factor applications.

Nominal Supply Voltage: 5 V

Operating at 5 V supply voltage ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Technical Specifications

Network Interfaces TJA1041T/N,112 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TJA1041T/N,112 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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