Loading...

TEA5711TD-T

NXP Semiconductors

TEA5711TD-T by NXP Semiconductors

TEA5711TD-T by NXP Semiconductors is a compact audio single-chip receiver with a max supply voltage of 12V and operates b/w -15 °C to 60 °C. It features low harmonic distortion at 0.8% and supports AM/FM demodulation. Ideal for consumer electronics, it ensures reliable audio performance in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,782 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,782

-

-

-

-

Anansix

USA . 2,717 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,717

-

-

-

-

Vyrian

USA . 2,540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,540

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,413 parts In-Stock

1+ parts

$19.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,413

$19.800

-

-

-

UNI Independent Distributors

Spain . 4,514 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,514

-

-

-

-

Corphita

USA . 2,217 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,217

-

-

-

-

Overview

Elevate your audio solutions with the TEA5711TD-T from NXP Semiconductors, a leader in innovation and quality. This advanced single-chip receiver delivers exceptional performance with minimal distortion, making it perfect for diverse applications in consumer electronics and communication systems. Experience superior sound clarity and reliability, backed by NXP's commitment to excellence, ensuring your projects stand out with unmatched value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body enhances durability and offers protection against moisture and environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact designs, enabling efficient use of board space and improving manufacturing processes.

Package Shape: RECTANGULAR

A rectangular shape can offer better layout flexibility on PCB design, aiding in efficient use of available space.

General IC Type: AUDIO SINGLE CHIP RECEIVER

As a single chip receiver designed specifically for audio applications, it simplifies design complexity and promotes more efficient signal processing.

Harmonic Distortion: 0.8%

A low harmonic distortion percentage ensures high sound quality with minimal interference, making it ideal for audio applications.

No. of Terminals: 32

Having 32 terminals provides a wide range of connectivity options, facilitating integration with various systems and components.

Package Style (Meter): SMALL OUTLINE

The small outline package allows for a compact footprint, which is essential for space-constrained applications.

Maximum Operating Temperature: 60 °C

With a maximum operating temperature of 60 °C, this product is designed to handle moderate heat environments, ensuring reliable performance in typical commercial settings.

Minimum Operating Temperature: -15 °C

The capability to operate down to -15 °C broadens the range of environments where this product can be deployed, making it versatile for various applications.

Terminal Position: DUAL

Dual terminal positioning enhances layout options on PCB, helping to optimize signal routing and improve overall performance.

Maximum Seated Height: 2.65 mm

A low seated height contributes to a slimmer profile, which is advantageous in designs where height constraints are a factor.

Width: 7.5 mm

A narrow width facilitates easy placement in tight spaces, enhancing design flexibility in compact electronic devices.

Minimum Supply Voltage (Vsup): 1.8 V

The low minimum supply voltage allows for compatibility with a wide range of battery-operated devices, promoting energy efficiency.

Maximum Time At Peak Reflow Temperature: 40s

This specification ensures that the product can withstand the reflow soldering process without compromising performance, making it reliable for mass production.

Peak Reflow Temperature: 245 °C

A peak reflow temperature of 245 °C is suitable for common soldering processes, enhancing manufacturability.

Length: 20.5 mm

The moderate length of 20.5 mm balances size with connectivity, making it an ideal choice for various applications.

Nominal Output Voltage (AM): 45 mV

The nominal output voltage for AM signals ensures sufficient signal strength for further amplification and processing in audio applications.

Demodulation Type: AM/FM

Supporting both AM and FM demodulation allows for versatile application in different audio broadcasting standards.

Temperature Grade: COMMERCIAL

Being graded for commercial use indicates consistent reliability and performance under standard operating conditions.

Technology: BIMOS

BIMOS technology combines the advantages of both bipolar and CMOS transistors, providing high performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form facilitates soldering to PCB, ensuring stable mechanical connections which are vital in portable devices.

Maximum Supply Current: 20 mA

A relatively low maximum supply current translates to improved battery life in portable applications, which is a significant advantage.

Nominal Output Voltage (FM): 61 mV

The nominal output voltage for FM signals enables robust audio output, improving quality in FM broadcasting applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard and makes design and assembly processes simpler and more efficient.

Maximum Supply Voltage (Vsup): 12 V

A maximum supply voltage of 12 V allows for operation with a wide range of power supplies, enhancing compatibility with various circuits.

Technical Specifications

Receiver ICs TEA5711TD-T attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

.8 %

JESD-30 Code:

R-PDSO-G32

Length:

20.5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-15 Cel

Nominal Output Voltage (AM):

45 mV

Nominal Output Voltage (FM):

61 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Technology:

BIMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Trade Compliance

TEA5711TD-T General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20