Loading...

TEA19032BAAT/1J

NXP Semiconductors

TEA19032BAAT/1J by NXP Semiconductors

TEA19032BAAT/1J by NXP Semiconductors is a Power Management IC with 10 terminals, operating at -20 to 105°C. It has a supply voltage of 5V and 8 channels for power supply support circuits. The small outline package is surface mountable, making it ideal for compact electronic devices.

Median Price

$1.530

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,337 parts In-Stock

1+ parts

-

100+ parts

$1.530

1k+ parts

$1.270

10k+ parts

$1.130

7,337

-

$1.530

$1.270

$1.130

DigiKey

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.262

5,000

-

-

-

$1.262

Verical

USA . 4,860 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.587

10k+ parts

$1.413

4,860

-

-

$1.587

$1.413

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,060 parts In-Stock

1+ parts

$1.188

100+ parts

-

1k+ parts

-

10k+ parts

-

1,060

$1.188

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.477

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$1.477

-

-

-

Vyrian

USA . 8,539 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,539

-

-

-

-

Anansix

USA . 523 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

523

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 7,253 parts In-Stock

1+ parts

$1.060

100+ parts

$1.034

1k+ parts

$1.028

10k+ parts

-

7,253

$1.060

$1.034

$1.028

-

Corphita

USA . 1,361 parts In-Stock

1+ parts

$1.125

100+ parts

-

1k+ parts

-

10k+ parts

-

1,361

$1.125

-

-

-

Argo Parts USA

USA . 3,470 parts In-Stock

1+ parts

$1.303

100+ parts

-

1k+ parts

-

10k+ parts

-

3,470

$1.303

-

-

-

Continental Prestige Electronics

USA . 923 parts In-Stock

1+ parts

$1.303

100+ parts

-

1k+ parts

-

10k+ parts

$1.277

923

$1.303

-

-

$1.277

Advanced Electronics

New Zealand . 66 parts In-Stock

1+ parts

$1.714

100+ parts

$1.577

1k+ parts

$1.477

10k+ parts

-

66

$1.714

$1.577

$1.477

-

Ampacity Inc.

Singapore . 7,305 parts In-Stock

1+ parts

$2.310

100+ parts

-

1k+ parts

-

10k+ parts

-

7,305

$2.310

-

-

-

Aztec Data Supply Inc.

USA . 22 parts In-Stock

1+ parts

$5.350

100+ parts

-

1k+ parts

-

10k+ parts

-

22

$5.350

-

-

-

Microchip USA

USA . 176 parts In-Stock

1+ parts

$7.883

100+ parts

-

1k+ parts

-

10k+ parts

-

176

$7.883

-

-

-

Corohmni

South Africa . 210 parts In-Stock

1+ parts

$16.644

100+ parts

-

1k+ parts

-

10k+ parts

-

210

$16.644

-

-

-

UNI Independent Distributors

Spain . 6,523 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,523

-

-

-

-

Robosynatics

Brazil . 250 parts In-Stock

1+ parts

-

100+ parts

$0.807

1k+ parts

$0.807

10k+ parts

$0.807

250

-

$0.807

$0.807

$0.807

Lucentia Tech

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$0.807

1k+ parts

$0.807

10k+ parts

$0.807

250

-

$0.807

$0.807

$0.807

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Overview

Elevate your power management game with the TEA19032BAAT/1J by NXP Semiconductors. Crafted with precision and expertise, this Power Management IC offers unparalleled performance and reliability for a wide range of applications. With its compact design and advanced features, this product provides customers with unmatched value, efficiency, and flexibility. Say goodbye to power management woes and hello to seamless operations with the TEA19032BAAT/1J. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are commonly used in power management ICs for their durability and heat resistance, making this product suitable for various operating conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, reducing production time and costs.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage is a standard in many electronic devices, ensuring compatibility and easy integration of this power management IC into different systems.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this power management IC can withstand demanding environmental conditions without compromising performance.

Terminal Position: DUAL

Dual terminal positions provide flexibility in PCB layout and design, allowing for efficient routing of connections.

No. of Channels: 8

Having 8 channels allows this power management IC to handle multiple power sources or loads simultaneously, making it versatile and suitable for complex power distribution systems.

Technical Specifications

Power Management ICs TEA19032BAAT/1J attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G10

Length:

6.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TEA19032BAAT/1J Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19