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TEA1088TD

NXP Semiconductors

TEA1088TD by NXP Semiconductors

TEA1088TD by NXP Semiconductors is a versatile power management IC designed for battery charging applications. It features a supply current of 19 mA, operates b/w 5.5 V and 31 V, and comes in a compact 16-terminal SO package. Ideal for efficient energy management in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,739 parts In-Stock

1+ parts

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4,739

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Digiode

USA . 3,797 parts In-Stock

1+ parts

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3,797

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Anansix

USA . 300 parts In-Stock

1+ parts

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,324 parts In-Stock

1+ parts

$6.500

100+ parts

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1,324

$6.500

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UNI Independent Distributors

Spain . 6,814 parts In-Stock

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6,814

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Corphita

USA . 938 parts In-Stock

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938

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Overview

Elevate your power management solutions with the TEA1088TD from NXP Semiconductors, a leader in innovative technology. This robust IC combines high efficiency and reliable performance, making it perfect for battery charge control across various applications. Designed for easy integration, its compact size and surface mount capability simplify your designs while enhancing reliability. Trust NXP's commitment to quality and unlock superior energy management to keep your systems running smoothly!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection against environmental impacts, making it an ideal choice for various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact designs, saving space on the PCB while enhancing performance.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout and design flexibility, enabling efficient use of space in electronics.

No. of Terminals: 16

With 16 terminals, this IC offers ample connections for diverse functionalities and expanded design possibilities.

Package Style (Meter): SMALL OUTLINE

The small outline package style is suited for compact devices, facilitating high-density PCB layouts and saving precious real estate.

Terminal Position: DUAL

Dual terminal positioning enhances the ease of mounting and improves circuit layout flexibility.

Other IC type: BATTERY CHARGE CONTROLLER

As a battery charge controller, this IC is crucial for efficient energy management in battery-operated devices, leading to longer battery life.

Maximum Supply Current (Isup): 19 mA

A maximum supply current of 19 mA ensures efficient power usage, making it suitable for low-power applications.

Terminal Form: GULL WING

The gull wing terminal form enables robust soldering and reliable connections, enhancing the overall durability of the device.

Switcher Config: SINGLE

Single switcher configuration simplifies design and reduces component count, leading to cost-effective solutions.

Minimum Input Voltage: 5.5 V

A minimum input voltage of 5.5 V allows for compatibility with a wide range of power supply sources, increasing design versatility.

Maximum Input Voltage: 31 V

With a maximum input voltage of 31 V, this IC can handle higher voltage applications, making it suitable for demanding environments.

Technical Specifications

Power Management ICs TEA1088TD attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Other IC type:

Maximum Input Voltage:

31 V

Minimum Input Voltage:

5.5 V

JESD-30 Code:

R-PDSO-G16

No. of Functions:

1

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Supply Current (Isup):

19 mA

Surface Mount:

YES

Switcher Config:

SINGLE

Terminal Form:

GULL WING

Terminal Position:

DUAL

Trade Compliance

TEA1088TD Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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