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TEA1088T

Philips Semiconductors

TEA1088T by Philips Semiconductors

Power Management Circuits; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE;

Median Price

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Vyrian

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Corel Iberica Componentes, S.L.

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One Stop Electronics

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Corphita

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Assy Fe

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Technical Specifications

Power Management ICs TEA1088T attributes and parameters. Explore more Power Management ICs devices from Philips Semiconductors

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

10

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

19 mA

Nominal Supply Voltage (Vsup):

10 V

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TEA1088T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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