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TEA1088T-T

NXP Semiconductors

TEA1088T-T by NXP Semiconductors

TEA1088T-T by NXP Semiconductors is a compact power management IC designed for battery charging applications. It features a max output current of 1 A, operates at a switching frequency of 33 kHz, and supports input voltages from 5.5 V to 31 V. Ideal for space-constrained designs, it comes in a small outline package with 16 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,361 parts In-Stock

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4,361

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Digiode

USA . 3,989 parts In-Stock

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3,989

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Anansix

USA . 326 parts In-Stock

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326

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One Stop Electronics

USA . 1,629 parts In-Stock

1+ parts

$2.500

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1,629

$2.500

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UNI Independent Distributors

Spain . 2,427 parts In-Stock

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Corphita

USA . 839 parts In-Stock

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Overview

Unlock the potential of your designs with the TEA1088T-T from NXP Semiconductors—a powerhouse in power management solutions. Renowned for quality and innovation, NXP delivers reliability that engineers trust. This versatile IC enhances efficiency in battery charging applications, ensuring optimal performance and longevity. Experience reduced system complexity and increased functionality, empowering you to create smarter, more durable products that stand out in any market!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials provides durability and resistance to environmental factors, ensuring long-lasting performance.

Surface Mount: YES

Surface mount technology allows for compact and efficient designs, making it suitable for modern, space-constrained applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, enabling a more organized layout and better thermal management.

No. of Terminals: 16

With 16 terminals, the device supports various functionalities and connectivity options, enhancing system integration capabilities.

Package Style (Meter): SMALL OUTLINE

Small outline package style reduces PCB area requirements and enables higher density designs, making it ideal for portable devices.

Control Mode: CURRENT-MODE

Current-mode control improves transient response and simplifies loop compensation, resulting in stable operation during load variations.

Terminal Position: DUAL

Dual terminal positions provide flexibility in mounting and routing on the PCB, improving design adaptability.

Maximum Seated Height: 1.75 mm

A low maximum seated height aids in miniaturization and is advantageous for applications where height constraints are critical.

Width: 3.9 mm

The narrow width allows for placement on tight layouts, contributing to overall space efficiency in device design.

Other IC type: BATTERY CHARGE CONTROLLER

This functionality makes the IC particularly beneficial for battery-powered devices, enhancing charging efficiency and safety.

Length: 9.9 mm

The compact length aids in fitting into space-restricted areas while providing robust performance.

Maximum Switching Frequency: 33 kHz

Higher switching frequencies enable smaller passive components, which further reduces the size and weight of the design.

Maximum Supply Current (Isup): 19 mA

A low maximum supply current ensures energy efficiency, which is critical for battery-operated devices.

Maximum Output Current: 1 A

The capability to deliver up to 1 A output current makes this IC suitable for a wide range of power management applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve mechanical stability on the PCB.

Control Technique: PULSE WIDTH MODULATION

PWM control technique enhances efficiency, allowing for better thermal management and reducing energy losses.

Switcher Config: SINGLE

A single switcher configuration simplifies design and reduces the number of components needed, optimizing reliability and cost.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is a standard that ensures compatibility with a wide range of PCB layouts and manufacturing processes.

Minimum Input Voltage: 5.5 V

A minimum input voltage of 5.5 V provides flexibility in power source options for various applications.

Maximum Input Voltage: 31 V

Support for high input voltage makes this IC suitable for diverse applications, including those requiring higher voltage supplies.

Technical Specifications

Power Management ICs TEA1088T-T attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

31 V

Minimum Input Voltage:

5.5 V

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Current (Isup):

19 mA

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

33 kHz

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TEA1088T-T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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