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TEA1088TD-T

NXP Semiconductors

TEA1088TD-T by NXP Semiconductors

TEA1088TD-T by NXP Semiconductors is a versatile power management IC designed for battery charging applications. It features a supply current of 19 mA, operates b/w 5.5 V and 31 V, and comes in a compact 16-terminal SO package. Ideal for efficient energy management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,696 parts In-Stock

1+ parts

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1k+ parts

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4,696

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Digiode

USA . 2,685 parts In-Stock

1+ parts

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1k+ parts

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2,685

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Anansix

USA . 2,658 parts In-Stock

1+ parts

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2,658

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 312 parts In-Stock

1+ parts

$7.500

100+ parts

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1k+ parts

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10k+ parts

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312

$7.500

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UNI Independent Distributors

Spain . 5,390 parts In-Stock

1+ parts

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1k+ parts

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5,390

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Corphita

USA . 2,350 parts In-Stock

1+ parts

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1k+ parts

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2,350

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Overview

Unlock the power of efficiency with the TEA1088TD-T from NXP Semiconductors, a leader in innovative solutions. This advanced Power Management IC seamlessly supports battery charging and enhances performance across various applications, from consumer electronics to industrial equipment. Enjoy reliable quality and optimized energy usage, ensuring your designs are not only cutting-edge but also cost-effective. Elevate your projects with the trusted expertise of NXP!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures the product is reliable and resistant to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for better performance in compact designs and enhances the ease of automated assembly.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on printed circuit boards, facilitating efficient layout and reducing overall footprint.

No. of Terminals: 16

With 16 terminals, this IC offers multiple connection options for various functionalities, increasing design flexibility.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps designers fit more components into limited spaces while maintaining ease of soldering.

Terminal Position: DUAL

Dual terminal positioning enhances layout versatility and can improve electrical performance in certain configurations.

Other IC Type: BATTERY CHARGE CONTROLLER

As a battery charge controller, this IC is essential for managing battery charging and maintenance, ensuring longevity and efficiency.

Maximum Supply Current (Isup): 19 mA

A maximum supply current of 19 mA ensures low power consumption, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing termination provides better mechanical stability and is easy to solder, making assembly more efficient.

Switcher Config: SINGLE

The single switch configuration simplifies the design and implementation processes, making it easier for developers to integrate.

Minimum Input Voltage: 5.5 V

A minimum input voltage of 5.5 V allows the IC to operate effectively in a variety of power environments, accommodating various supply systems.

Maximum Input Voltage: 31 V

With a maximum input voltage of 31 V, the IC can handle higher voltage levels, providing versatility for higher power applications.

Technical Specifications

Power Management ICs TEA1088TD-T attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Other IC type:

Maximum Input Voltage:

31 V

Minimum Input Voltage:

5.5 V

JESD-30 Code:

R-PDSO-G16

No. of Functions:

1

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Supply Current (Isup):

19 mA

Surface Mount:

YES

Switcher Config:

SINGLE

Terminal Form:

GULL WING

Terminal Position:

DUAL

Trade Compliance

TEA1088TD-T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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