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TEA1708T

NXP Semiconductors

TEA1708T by NXP Semiconductors

TEA1708T by NXP Semiconductors is a compact analog circuit IC in a small outline package, measuring 4.9mm x 3.9mm with an 8-terminal gull-wing design. It features surface mount capability and a max height of 1.75mm, ideal for space-constrained applications. This versatile component is perfect for various electronic devices requiring efficient signal processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,664 parts In-Stock

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4,664

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Vyrian

USA . 3,853 parts In-Stock

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3,853

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Anansix

USA . 1,963 parts In-Stock

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1,963

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,215 parts In-Stock

1+ parts

$0.500

100+ parts

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1,215

$0.500

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A-Z Elektronik GmbH

Germany . 5,384 parts In-Stock

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5,384

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Corphita

USA . 2,121 parts In-Stock

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2,121

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UNI Independent Distributors

Spain . 1,638 parts In-Stock

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1,638

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Kepictronics

USA . 453 parts In-Stock

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453

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Overview

Unlock the potential of your projects with the TEA1708T from NXP Semiconductors, a leader in innovation and reliability. This versatile analog circuit integrates seamlessly into various applications, enhancing performance while ensuring quality you can trust. Its compact design and surface-mount capabilities make it perfect for space-constrained environments. Experience unmatched value, efficiency, and superior functionality that elevate your designs to the next level!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures long-lasting performance and reliability in various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and automated assembly, improving production efficiency.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space and simplifies layout planning.

No. of Terminals: 8

An 8-terminal configuration provides versatile connectivity options, enhancing the functionality of the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, making it suitable for modern electronic devices.

Terminal Position: DUAL

Dual terminal positioning improves soldering reliability and electrical performance, ensuring stable connections.

Maximum Seated Height: 1.75 mm

Low profile height facilitates integration into slim designs, particularly in portable electronics.

Width: 3.9 mm

Narrow width supports high-density mounting on PCBs, making it an excellent choice for compact devices.

Other IC type: ANALOG CIRCUIT

As an analog circuit IC, it is well-suited for handling continuous signal processing applications.

Length: 4.9 mm

Short length allows for greater flexibility in PCB design without compromising on functionality.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide enhanced stability on printed circuit boards.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is a standard size that enables compatibility with a wide range of PCB layouts.

Technical Specifications

Other Function Semiconductors TEA1708T attributes and parameters. Explore more Other Function Semiconductors devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TEA1708T Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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