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TEA1612T/N1,518

NXP Semiconductors

TEA1612T/N1,518 by NXP Semiconductors

TEA1612T/N1,518 by NXP Semiconductors is a versatile MOS semiconductor designed for power supply applications. It operates at a nominal voltage of 13V and features a compact 24-terminal gull-wing package. With an operating temp range of -25 °C to 70 °C, it ensures reliability in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,710 parts In-Stock

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Digiode

USA . 4,867 parts In-Stock

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Anansix

USA . 618 parts In-Stock

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618

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One Stop Electronics

USA . 1,243 parts In-Stock

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$1.500

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Microchip USA

USA . 206 parts In-Stock

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$2.054

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206

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AZTECH Wire

Italy . 480 parts In-Stock

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$20.390

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480

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UNI Independent Distributors

Spain . 7,206 parts In-Stock

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Corphita

USA . 3,598 parts In-Stock

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Overview

Discover the TEA1612T/N1,518 by NXP Semiconductors, a game-changer in the realm of other function semiconductors. Renowned for its quality and reliability, NXP ensures that this compact, surface-mount device delivers exceptional performance across various applications. With operating temperatures from -25 °C to 70 °C, it thrives in diverse environments, offering customers unmatched flexibility and efficiency. Elevate your designs with a trusted partner committed to innovation and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a lightweight and durable package, ensuring reliability and protection under various operating conditions.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of board space, making integration into modern electronics easier.

Package Shape: RECTANGULAR

A rectangular shape facilitates efficient layout and assembly on PCB, optimizing space utilization.

Nominal Supply Voltage (Vsup): 13 V

The 13 V nominal supply voltage is suitable for various applications, offering flexibility in circuit design.

Power Supplies (V): 13

Having a consistent power supply voltage simplifies design considerations and ensures compatibility with standard electronic components.

No. of Terminals: 24

With 24 terminals, this semiconductor can accommodate complex functionalities while maintaining a manageable footprint.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, allowing for high-density circuit designs.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures the component can reliably function in moderately high-temperature environments.

Minimum Operating Temperature: -25 °C

The capability to operate down to -25 °C allows this product to be used in colder environments, broadening its application range.

Terminal Position: DUAL

Dual terminal positioning enhances mounting flexibility and ensures robust connections within the circuit.

Technology: MOS

MOS technology provides high efficiency and fast switching speeds, making it suitable for a wide range of electronic applications.

Terminal Form: GULL WING

Gull wing terminals offer excellent solder joint reliability and ease of assembly, improving manufacturing yield.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard for many surface-mount technologies, ensuring compatibility with existing manufacturing processes.

Technical Specifications

Other Function Semiconductors TEA1612T/N1,518 attributes and parameters. Explore more Other Function Semiconductors devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G24

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

13

Qualification:

Not Qualified

Sub-Category:

Other Analog ICs

Nominal Supply Voltage (Vsup):

13 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TEA1612T/N1,518 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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