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TEA1792TS/1

NXP Semiconductors

TEA1792TS/1 by NXP Semiconductors

TEA1792TS/1 by NXP Semiconductors is a small outline, thin profile analog circuit IC with 6 terminals. It operates at supply voltages ranging from 8.2V to 38V and is designed for surface mount applications. The package body material is plastic/epoxy, making it suitable for various electronic devices requiring compact components.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 15,793 parts In-Stock

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Digiode

USA . 4,288 parts In-Stock

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Anansix

USA . 1,477 parts In-Stock

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1,477

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Vyrian

USA . 1,427 parts In-Stock

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1,427

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 887 parts In-Stock

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$3.500

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887

$3.500

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Ampacity Inc.

Singapore . 1,434 parts In-Stock

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$5.500

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1,434

$5.500

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AZTECH Wire

Italy . 610 parts In-Stock

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$19.173

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610

$19.173

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Perfect Parts

USA . 27,082 parts In-Stock

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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22,000

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Lixinc

USA . 17,217 parts In-Stock

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A-Z Elektronik GmbH

Germany . 10,800 parts In-Stock

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10,800

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UNI Independent Distributors

Spain . 7,376 parts In-Stock

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Corphita

USA . 544 parts In-Stock

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544

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Elevate your electronic projects with the TEA1792TS/1 by NXP Semiconductors. Designed to deliver superior performance and reliability, this small outline, thin profile semiconductor offers endless possibilities for innovation. Whether you're working on power management, audio amplification, or any other analog circuitry, this versatile component is a game-changer. Trust in NXP Semiconductors' reputation for excellence and unlock the full potential of your creations. Experience the value, benefits, and advantages that the TEA1792TS/1 brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where portability and reliability are important.

Surface Mount: YES

The surface mount capability allows for easy installation on circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 20 V

The 20V supply voltage ensures compatibility with a wide range of systems and applications, providing flexibility and versatility.

No. of Terminals: 6

Having 6 terminals allows for multiple connections and functionality, increasing the potential uses and capabilities of the product.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style helps in saving space on the circuit board, making it suitable for compact designs.

Maximum Seated Height: 1.1 mm

The low maximum seated height allows for a slim profile and can be beneficial for applications with space constraints.

Width (mm): 1.5 mm

The narrow width of 1.5mm helps in accommodating the product in tight spaces and facilitates compact designs.

Other IC type: ANALOG CIRCUIT

Being an analog circuit type, the product is suitable for applications that require continuous and smooth signal processing.

Minimum Supply Voltage (Vsup): 8.2 V

With a minimum supply voltage of 8.2V, the product can operate efficiently even in lower voltage environments, maximizing its usability.

Length: 2.9 mm

The short length of 2.9mm helps in further saving space and can be advantageous for compact and streamlined designs.

Terminal Form: GULL WING

The gull wing terminal form is suitable for surface mount applications and offers secure solder connections, enhancing the product's reliability.

Terminal Pitch: 0.95 mm

The close terminal pitch of 0.95mm allows for high density mounting on the PCB, enabling more functionalities in a limited space.

Maximum Supply Voltage (Vsup): 38 V

The high maximum supply voltage of 38V ensures compatibility with systems requiring higher voltage inputs, making the product versatile in various applications.

Technical Specifications

Other Function Semiconductors TEA1792TS/1 attributes and parameters. Explore more Other Function Semiconductors devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G6

Length:

2.9 mm

No. of Functions:

1

No. of Terminals:

6

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

38 V

Minimum Supply Voltage (Vsup):

8.2 V

Nominal Supply Voltage (Vsup):

20 V

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width (mm):

1.5 mm

Trade Compliance

TEA1792TS/1 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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