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TDF8541TH/N2,518

NXP Semiconductors

TDF8541TH/N2,518 by NXP Semiconductors

TDF8541TH/N2,518 by NXP Semiconductors is a versatile audio amplifier designed for industrial applications. It operates at 14.4V with a max current of 350mA and features 4 functions in a compact rectangular package. With an operating temp range of -40 °C to 105 °C, it ensures reliability in diverse environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,904 parts In-Stock

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2,904

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Anansix

USA . 2,552 parts In-Stock

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2,552

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Digiode

USA . 276 parts In-Stock

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276

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Distributors (Availability)

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One Stop Electronics

USA . 273 parts In-Stock

1+ parts

$13.800

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273

$13.800

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AZTECH Wire

Italy . 895 parts In-Stock

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$14.580

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895

$14.580

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Microchip USA

USA . 452 parts In-Stock

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$18.962

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452

$18.962

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Component Stockers USA

USA . 346 parts In-Stock

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$99.990

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346

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Corphita

USA . 1,352 parts In-Stock

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UNI Independent Distributors

Spain . 317 parts In-Stock

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Overview

Experience exceptional audio with the TDF8541TH/N2,518 from NXP Semiconductors, a leader in innovation and quality. This versatile audio amplifier is designed for seamless integration into various applications, delivering powerful performance while ensuring reliability in diverse environments. Benefit from superior sound clarity and efficiency that enhances your products, making them stand out in today’s competitive market. Elevate your designs with NXP's commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers durability and resistance to environmental factors, ensuring long-lasting performance.

Surface Mount: YES

Surface mount capability allows for compact designs and easier integration into modern electronic systems, making it suitable for space-constrained applications.

No. of Functions: 4

With four functions, this amplifier can handle multiple audio processing tasks effectively, providing versatile performance for various applications.

Package Shape: RECTANGULAR

The rectangular package shape is standard for many designs, facilitating easy placement on printed circuit boards (PCBs).

General IC Type: AUDIO AMPLIFIER

Being specifically designed as an audio amplifier, it excels in delivering high-quality sound and is ideal for audio applications.

Power Supplies (V): 14.4

A power supply rating of 14.4V indicates compatibility with a wide range of audio devices, offering robust performance without the need for specialized power sources.

No. of Terminals: 36

The 36 terminals provide ample connectivity options for various input and output configurations, enhancing the flexibility of the amplifier in different setups.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design contribute to space optimization on PCBs while maintaining connectivity integrity.

Maximum Operating Temperature: 105 °C

A maximum operating temperature of 105 °C ensures reliable performance even in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this amplifier can function in extreme cold environments, enhancing its versatility in various climates.

Terminal Position: DUAL

Dual terminal positions aid in better routing options on PCBs, simplifying the design process for engineers.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees reliability and prolonged lifespan in demanding operational conditions, making it a robust choice for heavy-duty applications.

Technology: BCDMOS

Utilizing BCDMOS technology, this amplifier offers superior efficiency and performance characteristics, providing a competitive edge in the market.

Terminal Form: GULL WING

The gull wing terminal form enhances soldering quality and reliability, ensuring a strong electrical connection in production.

Maximum Supply Current: 350 mA

A maximum supply current of 350 mA indicates sufficient power handling capability for demanding audio applications, making it versatile in different setups.

Terminal Pitch: 0.635 mm

The 0.635 mm terminal pitch allows for denser designs while still being amenable to standard PCB manufacturing processes.

Technical Specifications

Audio & Video Amplifiers TDF8541TH/N2,518 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G36

No. of Functions:

4

No. of Terminals:

36

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

14.4

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

350 mA

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

TDF8541TH/N2,518 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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