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TDF8541J/N2,112

NXP Semiconductors

TDF8541J/N2,112 by NXP Semiconductors

TDF8541J/N2,112 by NXP Semiconductors is a versatile audio amplifier with 4 functions and operates at 14.4V. It features a robust temperature range of -40 °C to 105 °C and consumes a max supply current of 350mA. Ideal for industrial audio applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,960 parts In-Stock

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5,960

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Digiode

USA . 3,370 parts In-Stock

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3,370

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Anansix

USA . 715 parts In-Stock

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715

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Distributors (Availability)

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One Stop Electronics

USA . 1,252 parts In-Stock

1+ parts

$12.800

100+ parts

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1,252

$12.800

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AZTECH Wire

Italy . 303 parts In-Stock

1+ parts

$16.930

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303

$16.930

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Microchip USA

USA . 5,288 parts In-Stock

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5,288

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QUARKTWIN TECHNOLOGY LTD

USA . 4,549 parts In-Stock

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4,549

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Corphita

USA . 4,032 parts In-Stock

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4,032

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UNI Independent Distributors

Spain . 1,867 parts In-Stock

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1,867

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Overview

Elevate your audio experience with the TDF8541J/N2,112 from NXP Semiconductors. Renowned for their commitment to quality, NXP delivers a powerful audio amplifier that excels in various applications—from automotive sound systems to industrial audio solutions. Designed for durability and efficiency, this amplifier ensures crisp sound at extreme temperatures, providing unmatched reliability. Choose NXP for superior performance that resonates with your needs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures robustness and effective protection against environmental factors, making it ideal for industrial applications.

No. of Functions: 4

With four functions, this amplifier offers versatile capabilities, making it suitable for various audio applications and enhancing its utility.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient board layout and space optimization in electronic designs.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, it is specifically designed to enhance sound quality, making it perfect for audio applications.

Power Supplies (V): 14.4

Operating at a standard power supply of 14.4V, this amplifier can be easily integrated into existing systems with minimal modifications.

No. of Terminals: 16

The 16 terminals provide ample connectivity options, facilitating easy integration and flexibility in circuit designs.

Package Style (Meter): IN-LINE

The in-line package style is conducive for streamlined circuit layouts, making assembly and placement simple and efficient.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105 °C, this component can perform reliably in high-temperature environments.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C makes this amplifier suitable for use in extreme conditions, ensuring consistent functionality.

Terminal Position: ZIG-ZAG

Zig-zag terminal positioning aids in compact designs, allowing for denser arrangements on PCBs.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this amplifier is designed for high reliability and durability in challenging environments.

Technology: BCDMOS

Utilizing BCDMOS technology enhances performance and efficiency, leading to lower power consumption and improved sound quality.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure robust mechanical support and make soldering easier for more reliable connections.

Maximum Supply Current: 350 mA

With a maximum supply current of 350 mA, this amplifier can deliver satisfactory power while maintaining efficiency.

Terminal Pitch: 1 mm

A 1 mm terminal pitch allows for compact design layouts, accommodating more components in a smaller footprint.

Technical Specifications

Audio & Video Amplifiers TDF8541J/N2,112 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PZIP-T27

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP27,.16,.16,40

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

14.4

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

350 mA

Surface Mount:

NO

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDF8541J/N2,112 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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