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TDF8530TH/N1,518

NXP Semiconductors

TDF8530TH/N1,518 by NXP Semiconductors

TDF8530TH/N1,518 by NXP Semiconductors is a versatile audio amplifier with 4 functions and operates b/w -40 °C to 85 °C. It features a compact 44-terminal package and supports power supplies of 14.4V, making it ideal for industrial audio applications. Its AEC-Q100 screening ensures reliability in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,161 parts In-Stock

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6,161

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Digiode

USA . 3,455 parts In-Stock

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3,455

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Anansix

USA . 2,851 parts In-Stock

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2,851

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Distributors (Availability)

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AZTECH Wire

Italy . 1,128 parts In-Stock

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$8.040

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$8.040

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One Stop Electronics

USA . 1,309 parts In-Stock

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$18.800

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1,309

$18.800

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Component Stockers USA

USA . 295 parts In-Stock

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$99.990

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295

$99.990

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GreenTree Electronics

Israel . 30,000 parts In-Stock

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30,000

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QUARKTWIN TECHNOLOGY LTD

USA . 14,739 parts In-Stock

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14,739

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Microchip USA

USA . 5,181 parts In-Stock

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Corphita

USA . 4,222 parts In-Stock

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4,222

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UNI Independent Distributors

Spain . 2,232 parts In-Stock

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2,232

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Experience superior audio quality with the TDF8530TH/N1,518 from NXP Semiconductors, a trusted leader in innovative technology. This compact audio amplifier ensures exceptional sound performance across diverse applications, from automotive systems to industrial setups. With its robust design and AEC-Q100 screening, it guarantees reliability even in extreme conditions. Elevate your projects with the unmatched value and efficiency this amplifier brings, delivering powerful sound while optimizing space and energy.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and thermal stability, which is essential for long-term performance in audio applications.

Surface Mount: YES

The surface mount capability allows for compact designs and efficient production processes, making it easy to integrate into modern electronics.

No. of Functions: 4

With four functions, this amplifier offers versatile performance, suitable for multiple audio applications without the need for additional components.

Screening Level: AEC-Q100

Meeting AEC-Q100 ensures reliability in automotive applications, making it a trustworthy choice for demanding environments.

Package Shape: RECTANGULAR

The rectangular package shape maximizes board space utilization, providing flexibility in layout design for engineers.

General IC Type: AUDIO AMPLIFIER

Being designed specifically as an audio amplifier guarantees optimal sound quality and performance for audio processing tasks.

Power Supplies (V): 14.4

The specified supply voltage of 14.4V is suitable for many audio applications, ensuring compatibility with a wide range of power sources.

No. of Terminals: 44

With 44 terminals, the amplifier can support multiple inputs and outputs, enhancing its versatility for complex audio systems.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design make this amplifier ideal for space-constrained applications, such as portable audio devices.

Maximum Operating Temperature: 85 °C

An operating temperature of 85 °C ensures that the amplifier can function effectively in a variety of environments, adding to its reliability.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this amplifier is capable of functioning in extreme cold, making it ideal for outdoor or industrial use.

Terminal Position: DUAL

Dual terminal positioning can simplify PCB layout and enhance signal integrity, which is crucial for high-fidelity audio applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures robust performance across a wide temperature range, suitable for demanding applications.

Technology: BCDMOS

BCD technology combines high-voltage and low-voltage capabilities, promoting energy efficiency and improved performance, crucial for audio amplification.

Terminal Form: GULL WING

Gull wing terminals provide reliable solder joints and facilitate easier assembly, reducing the risk of defects during production.

Maximum Supply Current: 200 mA

Providing a maximum supply current of 200 mA allows the amplifier to drive larger loads, enhancing its performance for a variety of audio signals.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm allows for tighter packing on PCBs while maintaining ease of handling, beneficial for compact circuit designs.

Technical Specifications

Audio & Video Amplifiers TDF8530TH/N1,518 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G44

No. of Functions:

4

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP44,.55

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

14.4

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

200 mA

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

TDF8530TH/N1,518 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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