Loading...

TDA8933BTW/N2,512

NXP Semiconductors

TDA8933BTW/N2,512 by NXP Semiconductors

AUDIO AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,785 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,785

-

-

-

-

Digiode

USA . 1,653 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,653

-

-

-

-

Anansix

USA . 591 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

591

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 238 parts In-Stock

1+ parts

$3.481

100+ parts

-

1k+ parts

-

10k+ parts

-

238

$3.481

-

-

-

AZTECH Wire

Italy . 835 parts In-Stock

1+ parts

$15.010

100+ parts

-

1k+ parts

-

10k+ parts

-

835

$15.010

-

-

-

One Stop Electronics

USA . 1,254 parts In-Stock

1+ parts

$15.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,254

$15.800

-

-

-

Component Stockers USA

USA . 323 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

323

$99.990

-

-

-

Corphita

USA . 4,655 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,655

-

-

-

-

UNI Independent Distributors

Spain . 3,294 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,294

-

-

-

-

Technical Specifications

Audio & Video Amplifiers TDA8933BTW/N2,512 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Gain:

36 dB

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G32

Length:

11 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

20.6 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

25

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

TDA8933BTW/N2,512 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20