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TDA8922CJ/N1,112

NXP Semiconductors

TDA8922CJ/N1,112 by NXP Semiconductors

TDA8922CJ/N1,112 by NXP Semiconductors is a robust audio amplifier designed for industrial applications. It operates at ±30V with a max supply current of 75mA and features a temperature range from -40 °C to 85 °C. Its compact 23-terminal design ensures efficient performance in various audio systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,135 parts In-Stock

1+ parts

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6,135

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Digiode

USA . 4,111 parts In-Stock

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4,111

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J2 Sourcing AB

Sweden . 3,200 parts In-Stock

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3,200

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Anansix

USA . 1,254 parts In-Stock

1+ parts

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1,254

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ComSIT Distribution GmbH

Germany . 289 parts In-Stock

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289

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 134 parts In-Stock

1+ parts

$3.860

100+ parts

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134

$3.860

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One Stop Electronics

USA . 414 parts In-Stock

1+ parts

$18.800

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414

$18.800

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AZTECH Wire

Italy . 816 parts In-Stock

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$19.350

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816

$19.350

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Corphita

USA . 1,043 parts In-Stock

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1,043

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UNI Independent Distributors

Spain . 8 parts In-Stock

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8

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Overview

Elevate your audio experience with the TDA8922CJ/N1,112 from NXP Semiconductors! Renowned for their commitment to quality and innovation, NXP delivers a powerhouse amplifier designed for versatility in various applications, ensuring clear, powerful sound in any environment. With robust performance in extreme temperatures and efficient power consumption, this amplifier is the perfect choice for those seeking reliability and exceptional audio clarity. Unlock the potential of your sound systems today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures durability and resistance to environmental factors, making it suitable for industrial applications.

No. of Functions: 2

Having two functions allows for a versatile application, enabling the integration of multiple audio amplification needs in a single device.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space efficiency and can easily fit into a variety of electronic designs.

General IC Type: AUDIO AMPLIFIER

Being classified as an audio amplifier indicates a focus on high-quality sound performance, making it ideal for audio-centric devices.

Power Supplies (V): ±30

The capability to support both positive and negative 30 volts allows for greater flexibility in power supply configurations.

No. of Terminals: 23

With 23 terminals, this amplifier offers extensive connectivity options for robust integration into complex circuits.

Package Style (Meter): IN-LINE

The in-line package style facilitates easier installation and integration into existing systems, enhancing user-friendliness.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in a range of environments, making it suitable for industrial use.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C means this amplifier can operate effectively in extreme cold, increasing its application scope.

Terminal Position: ZIG-ZAG

Zig-zag terminal positioning improves packing density on PCBs, allowing for compact designs without sacrificing functionality.

Peak Reflow Temperature °C: 225

A peak reflow temperature of 225 °C ensures compatibility with modern PCB assembly processes, making manufacturing easier.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates high reliability and performance stability in harsh environments.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide better mechanical strength and reliability in connections, ideal for durability in demanding applications.

Maximum Supply Current: 75 mA

A maximum supply current of 75 mA allows this amplifier to operate efficiently while minimizing power consumption.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm enables compact layouts without difficulty in soldering or assembly, supporting versatile designs.

Technical Specifications

Audio & Video Amplifiers TDA8922CJ/N1,112 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PZIP-T23

No. of Functions:

2

No. of Terminals:

23

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP23,.2,.17

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

225

Power Supplies (V):

+-30

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

75 mA

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA8922CJ/N1,112 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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