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TDA8705AT

NXP Semiconductors

TDA8705AT by NXP Semiconductors

TDA8705AT from NXP is a 6-bit ADC with a sample rate of 80 MHz, ideal for high-speed data acquisition. It features a max linearity error of 0.7812% and operates within -0 °C to 70 °C. This compact surface-mount device is perfect for commercial applications requiring precise analog-to-digital conversion.

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8

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Vyrian

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Anansix

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Digiode

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Cyclops Electronics Ltd

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R&J Components

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Prism Electronics

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ComSIT Distribution GmbH

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One Stop Electronics

USA . 943 parts In-Stock

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UNI Independent Distributors

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Corphita

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Overview

Elevate your designs with the TDA8705AT from NXP Semiconductors, a trusted leader in cutting-edge technology. This robust 6-bit Analog-to-Digital Converter ensures exceptional performance and precision, making it ideal for a variety of applications—from industrial automation to consumer electronics. Experience unparalleled reliability and efficiency, backed by NXP's commitment to quality. Enhance your projects with an ADC that delivers outstanding value and seamless integration!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and protection against environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of board space and enables automated assembly, enhancing production efficiency.

No. of Functions: 2

Having multiple functions increases versatility and allows for more complex applications, reducing the need for additional components.

Package Shape: RECTANGULAR

The rectangular shape is commonly used, making it compatible with standard PCBs and easing design considerations.

No. of Bits: 6

A 6-bit resolution strikes a balance between performance and simplicity, making it suitable for low-to-moderate precision applications.

Maximum Linearity Error (EL): 0.7812 %

Low linearity error improves the accuracy of the conversion, ensuring reliable data representation in applications.

No. of Terminals: 28

A larger number of terminals offers ample connectivity options for integration into various circuits.

Package Style (Meter): SMALL OUTLINE

Small outline packages are typically more space-efficient, making them ideal for compact designs.

Maximum Operating Temperature: 70 °C

The operational temperature range allows the product to function reliably in diverse environments without overheating.

Minimum Operating Temperature: 0 °C

The minimum temperature specification ensures the ADC can operate in cooler conditions, expanding its application range.

Terminal Position: DUAL

Dual terminal positioning enhances the ease of mounting and soldering, providing better connections.

Maximum Seated Height: 2.65 mm

A low seated height accommodates designs with space constraints while maintaining a secure connection.

Width: 7.5 mm

A compact width enables use in tight spaces, providing flexibility in design layouts.

Length: 17.9 mm

The length is ideal for standard PCB layouts, facilitating easy integration into existing designs.

Temperature Grade: COMMERCIAL

Commercial temperature grading indicates reliability for everyday applications, making it suitable for a wide range of consumer products.

Maximum Analog Input Voltage: 0.55 V

The max input voltage allows the ADC to interface effectively with low-voltage sensors, enabling accurate signal processing.

Sample Rate: 80 MHz

A high sample rate provides the capability to capture fast-changing signals, ideal for high-speed applications.

Terminal Form: GULL WING

Gull wing terminals enhance soldering support, providing reliability in connections and minimizing production errors.

Maximum Supply Current: 32 mA

The low supply current helps in conserving power, making it suitable for battery-operated devices.

Converter Type: ADC, RESISTANCE LADDER

Resistance ladder design enables straightforward scaling for a variety of input signals, providing flexibility in application.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V simplifies power supply requirements, making it easier to integrate into existing designs.

Output Bit Code: BINARY CODED DECIMAL

Binary coded decimal output facilitates easier interpretation of the output values, which is useful in various display applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm provides a balance between density and ease of soldering, contributing to reliable assembly.

Minimum Analog Input Voltage: 0.45 V

The minimum input voltage allows the ADC to accurately interpret low-level signals, ensuring precise performance across a range of inputs.

Output Format: PARALLEL, WORD

Parallel output allows for faster data transmission rates, making it more efficient for high-speed digital systems.

Technical Specifications

Analog-to-Digital Converters TDA8705AT attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

2

No. of Bits:

6

Output Bit Code:

Binary Coded Decimal

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.7812 %

Sample Rate:

80 MHz

Electrical Specifications

Minimum Analog Input Voltage:

450 mV

Maximum Analog Input Voltage:

550 mV

Nominal Supply Voltage:

5 V

Maximum Supply Current:

32 mA

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.705 in (17.9 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

Trade Compliance

TDA8705AT Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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