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TDA8703TD

NXP Semiconductors

TDA8703TD by NXP Semiconductors

TDA8703TD from NXP is an 8-bit ADC with a sample rate of 40 MHz, ideal for high-speed data acquisition. It operates b/w 1.48V and 3.2V, ensuring precision with a max linearity error of just 0.7812%. This compact surface-mount device suits various commercial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 1,097 parts In-Stock

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Bristol Electronics

USA . 968 parts In-Stock

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Anansix

USA . 924 parts In-Stock

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924

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Digiode

USA . 253 parts In-Stock

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One Stop Electronics

USA . 357 parts In-Stock

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$14.000

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UNI Independent Distributors

Spain . 2,976 parts In-Stock

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Corphita

USA . 2,799 parts In-Stock

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Overview

Experience precision and performance with the TDA8703TD from NXP Semiconductors, a trusted leader in innovative technology. This 8-bit analog-to-digital converter excels in delivering high-quality data for various applications, from industrial automation to consumer electronics. With its compact design and robust temperature range, it ensures reliable operation in any environment. Elevate your projects by leveraging the unmatched reliability and efficiency that only NXP can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection of the internal components from environmental factors.

Surface Mount: YES

Surface mount technology allows for a compact design, making it suitable for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular shape is optimized for efficient board layout and integration into various systems.

No. of Bits: 8

An 8-bit resolution strikes a balanced performance for many applications, providing sufficient precision for general purpose use.

Maximum Linearity Error (EL): 0.7812 %

Low linearity error ensures high accuracy in signal conversion, making it reliable for sensitive applications.

No. of Terminals: 24

The 24-terminal configuration allows for versatile connections and ease of integration into complex circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a reduced footprint on the PCB, enhancing space efficiency.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C makes it suitable for industrial applications with moderate thermal conditions.

Minimum Operating Temperature: 0 °C

Operating down to 0 °C extends its application range to environments that experience cold temperatures.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB design options, enhancing usability in various layouts.

Maximum Seated Height: 2.65 mm

A low seated height contributes to the slim profile of the PCB assembly, beneficial for compact electronic designs.

Width: 7.5 mm

A narrow width aids in board space efficiency, particularly in dense electronic arrangements.

Length: 15.4 mm

The length is optimized for balancing layout needs while ensuring effective circuit board usage.

Temperature Grade: COMMERCIAL

Commercial temperature grading makes it suitable for general applications typically found in consumer electronics.

Maximum Analog Input Voltage: 3.2 V

This voltage specification provides flexibility for interfacing with various sensors and analog sources.

Sample Rate: 40 MHz

A sample rate of 40 MHz enables rapid processing of incoming signals, suitable for high-speed applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and reliable connections, ensuring robust performance.

Maximum Supply Current: 36 mA

A maximum supply current of 36 mA ensures low power consumption, making it efficient for portable applications.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary method may offer unique advantages in performance, making this ADC potentially superior for specific use cases.

Nominal Supply Voltage: 5 V

Operating at a standard 5 V supply simplifies circuit design and integration with common logic components.

Output Bit Code: BINARY, 2'S COMPLEMENT BINARY

Using 2's complement format simplifies digital processing for various applications, enhancing compatibility.

Terminal Pitch: 1.27 mm

The 1.27 mm pitch is standardized for ease of PCB layout and design, ensuring compatibility with existing systems.

Minimum Analog Input Voltage: 1.48 V

The ability to handle a minimum input voltage of 1.48 V allows for interfacing with low-voltage signals.

Output Format: PARALLEL, 8 BITS

The parallel output format allows for simultaneous data transmission, improving overall data throughput.

Technical Specifications

Analog-to-Digital Converters TDA8703TD attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Parallel, 8 Bits

Maximum Linearity Error (EL):

0.7812 %

Sample Rate:

40 MHz

Electrical Specifications

Minimum Analog Input Voltage:

1.48 V

Maximum Analog Input Voltage:

3.2 V

Nominal Supply Voltage:

5 V

Maximum Supply Current:

36 mA

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

24

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.606 in (15.4 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G24

Qualified:

No

Trade Compliance

TDA8703TD Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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