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TDA8703TD-T

NXP Semiconductors

TDA8703TD-T by NXP Semiconductors

A/D CONVERTER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,930 parts In-Stock

1+ parts

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1k+ parts

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4,930

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Anansix

USA . 2,808 parts In-Stock

1+ parts

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2,808

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Sea View Technologies

USA . 1,957 parts In-Stock

1+ parts

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100+ parts

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1,957

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Bristol Electronics

USA . 1,957 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,957

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Digiode

USA . 122 parts In-Stock

1+ parts

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122

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 692 parts In-Stock

1+ parts

$34.000

100+ parts

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1k+ parts

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10k+ parts

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692

$34.000

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UNI Independent Distributors

Spain . 7,990 parts In-Stock

1+ parts

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7,990

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Corphita

USA . 4,764 parts In-Stock

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4,764

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Technical Specifications

Analog-to-Digital Converters TDA8703TD-T attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, Offset Binary

Maximum Linearity Error (EL):

0.78 %

Electrical Specifications

Power Supplies:

5 V

Maximum Analog Input Voltage:

3.4 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

24

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP24,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G24

Qualified:

No

JESD-609 Code:

e0

Trade Compliance

TDA8703TD-T Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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