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TDA8703

NXP Semiconductors

TDA8703 by NXP Semiconductors

ADC, RESISTANCE LADDER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

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Digiode

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Anansix

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J2 Sourcing AB

Sweden . 425 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Vyrian

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Connector Distribution Corp

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Right Parts Inc.

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ComSIT Distribution GmbH

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Pegasus Components GmbH

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Digital Electronic Gebert Verwaltungs UG

Germany . 14 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 6 parts In-Stock

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Donberg Electronics Ltd

Ireland . 6 parts In-Stock

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LittleDiode

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Electronic Expediters

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GES GmbH

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A&K Electronics

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Rotakorn

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Bristol Electronics

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LWI Electronics Inc

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First Choice Components Inc.

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One Stop Electronics

USA . 1,424 parts In-Stock

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Corphita

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Assy Fe

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A-Plus Industry Inc.

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Technical Specifications

Analog-to-Digital Converters TDA8703 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Parallel, 8 Bits

Maximum Linearity Error (EL):

0.3906 %

Sample Rate:

40 MHz

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

3.115 V

Maximum Analog Input Voltage:

3.385 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

24

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Width:

0.6 in (15.24 mm)

Length:

1.248 in (31.7 mm)

Maximum Seated Height:

0.201 in (5.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

In-Line

Package Shape:

Package Equivalence Code:

DIP24,.6

Package Code:

DIP

Standards and Codes

JESD-30 Code:

R-PDIP-T24

Qualified:

No

Trade Compliance

TDA8703 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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