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TDA8569Q/N1,112

NXP Semiconductors

TDA8569Q/N1,112 by NXP Semiconductors

AUDIO AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 23; Package Code: ZIP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,444 parts In-Stock

1+ parts

-

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5,444

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Digiode

USA . 4,922 parts In-Stock

1+ parts

-

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1k+ parts

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4,922

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Anansix

USA . 1,120 parts In-Stock

1+ parts

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1,120

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Cogito LLC

Ukraine . 528 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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528

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$0.274

100+ parts

$0.249

1k+ parts

$0.225

10k+ parts

-

40

$0.274

$0.249

$0.225

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Microchip USA

USA . 160 parts In-Stock

1+ parts

$2.050

100+ parts

-

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160

$2.050

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One Stop Electronics

USA . 453 parts In-Stock

1+ parts

$4.800

100+ parts

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453

$4.800

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AZTECH Wire

Italy . 1,001 parts In-Stock

1+ parts

$11.460

100+ parts

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1,001

$11.460

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UNI Independent Distributors

Spain . 6,458 parts In-Stock

1+ parts

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6,458

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Corphita

USA . 2,009 parts In-Stock

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2,009

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Technical Specifications

Audio & Video Amplifiers TDA8569Q/N1,112 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Gain:

26 dB

Harmonic Distortion:

10 %

JESD-30 Code:

R-PZFM-T23

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

23

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

40 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP23,.2,.17

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

360 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA8569Q/N1,112 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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