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TDA8296HN/C1,551

NXP Semiconductors

TDA8296HN/C1,551 by NXP Semiconductors

TDA8296HN/C1,551 by NXP Semiconductors is a CMOS consumer IC in a square chip carrier package. It operates b/w -20 °C to 85 °C with power supplies of 1.2V and 3.3V, featuring 40 terminals for efficient surface mounting in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,457 parts In-Stock

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5,457

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Digiode

USA . 3,365 parts In-Stock

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3,365

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Anansix

USA . 810 parts In-Stock

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810

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AZTECH Wire

Italy . 742 parts In-Stock

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$11.910

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742

$11.910

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One Stop Electronics

USA . 1,361 parts In-Stock

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$18.800

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1,361

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UNI Independent Distributors

Spain . 6,640 parts In-Stock

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Corphita

USA . 1,866 parts In-Stock

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Perfect Parts

USA . 560 parts In-Stock

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560

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Overview

Elevate your designs with the TDA8296HN/C1,551 from NXP Semiconductors, a leader in quality and innovation. This robust IC seamlessly integrates into diverse applications like consumer electronics and IoT devices, providing unmatched reliability in varying temperatures. With easy surface mount capabilities and superior performance, it ensures your projects achieve peak efficiency—unlocking value and peace of mind for every engineer and developer. Choose NXP for excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and enhances the ease of integration into modern circuit boards.

Package Shape: SQUARE

The square package shape optimizes space utilization on PCBs, allowing for denser layouts in electronic designs.

Power Supplies (V): 1.2, 3.3

Supports multiple voltage levels which increases versatility for powering different types of circuits.

No. of Terminals: 40

A higher number of terminals provides more I/O options, facilitating complex functionalities in a single package.

Package Style (Meter): CHIP CARRIER

Chip carrier style offers robust connections to the board, enhancing the reliability of the electronic assembly.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is capable of functioning effectively in moderately high temperature environments.

Minimum Operating Temperature: -20 °C

This IC can operate in low-temperature environments, widening its application range across different climates.

Terminal Position: QUAD

Quad terminal positioning allows for flexible routing options on the PCB, which is beneficial for minimizing circuit layout complexity.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C is conducive for modern manufacturing processes, ensuring compatibility with high-temperature soldering techniques.

Technology: CMOS

CMOS technology is known for low power consumption and high noise immunity, making it an ideal choice for battery-operated devices.

Terminal Form: NO LEAD

No lead terminals provide a smaller footprint and enhance the overall performance by reducing inductance in the connections.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density soldering, which is crucial for compact electronic designs.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates the product can withstand moderate exposure to moisture, making it reliable for various manufacturing and storage conditions.

Technical Specifications

Other Function Consumer ICs TDA8296HN/C1,551 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N40

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA8296HN/C1,551 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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