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TDA8120

STMicroelectronics

TDA8120 by STMicroelectronics

TDA8120 by STMicroelectronics is a 24-terminal IC with 12V power supply, in-line package style, and tin/lead terminal finish. It is used in consumer electronics for various functions due to its rectangular shape and through-hole terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,638 parts In-Stock

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3,638

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ComSIT Distribution GmbH

Germany . 2,231 parts In-Stock

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2,231

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Anansix

USA . 1,228 parts In-Stock

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Vyrian

USA . 1,093 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 41 parts In-Stock

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41

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Huijzer Components

Netherlands . 22 parts In-Stock

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22

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LittleDiode

UK . 12 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 12 parts In-Stock

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12

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,462 parts In-Stock

1+ parts

$2.776

100+ parts

-

1k+ parts

$2.498

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1,462

$2.776

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$2.498

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MKK Technologies

India . 584 parts In-Stock

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$5.219

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584

$5.219

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DigiPath Technology Company

USA . 584 parts In-Stock

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$5.219

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584

$5.219

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Corphita

USA . 1,408 parts In-Stock

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Assy Fe

Spain . 531 parts In-Stock

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531

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Parana Technologies

USA . 101 parts In-Stock

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$3.319

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101

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$3.319

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Overview

Upgrade your consumer electronics with the reliable and high-quality TDA8120 by STMicroelectronics. With its advanced technology and superior manufacturing standards, this product is designed to enhance the performance of various applications in the consumer electronics category. Experience seamless functionality and improved efficiency with the TDA8120, offering customers unparalleled value and benefits. Trust in STMicroelectronics for top-of-the-line products that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components of the IC, making it resistant to damage from environmental factors.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on circuit boards and saves space, making it ideal for compact electronic devices.

Power Supplies (V): 12

Operating at a voltage of 12V provides sufficient power for the IC to function optimally, ensuring reliable performance in various applications.

No. of Terminals: 24

Having 24 terminals allows for versatile connectivity options and enables the IC to interface with multiple external components, enhancing functionality.

Package Style (Meter): IN-LINE

The in-line package style facilitates easy integration into existing circuit designs and simplifies the installation process, saving time and effort during assembly.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish ensures good conductivity and solderability, enabling secure connections between the IC and other circuit components.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options and accommodates different circuit configurations, increasing the adaptability of the IC.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the assembly process by providing a secure and stable connection between the IC and the circuit board, reducing the risk of disconnection.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch ensures compatibility with standard spacing requirements on circuit boards, making it easy to integrate the IC into various electronic systems.

Technical Specifications

Other Function Consumer ICs TDA8120 attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e0

No. of Terminals:

24

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TDA8120 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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