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TDA8200

STMicroelectronics

TDA8200 by STMicroelectronics

TDA8200 by STMicroelectronics is a consumer circuit IC with 28 terminals in an in-line package. It operates b/w -25 °C to 125°C, with power supply of 8.5V. This rectangular plastic/epoxy IC is commonly used in various consumer electronic applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,240 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,240

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-

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Vyrian

USA . 1,604 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,604

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-

-

-

Anansix

USA . 1,115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,115

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 725 parts In-Stock

1+ parts

$0.400

100+ parts

-

1k+ parts

$0.360

10k+ parts

-

725

$0.400

-

$0.360

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MKK Technologies

India . 2,178 parts In-Stock

1+ parts

$0.753

100+ parts

-

1k+ parts

-

10k+ parts

-

2,178

$0.753

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-

-

DigiPath Technology Company

USA . 2,178 parts In-Stock

1+ parts

$0.753

100+ parts

-

1k+ parts

-

10k+ parts

-

2,178

$0.753

-

-

-

Corphita

USA . 4,401 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,401

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-

-

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Parana Technologies

USA . 1,365 parts In-Stock

1+ parts

-

100+ parts

$0.478

1k+ parts

-

10k+ parts

-

1,365

-

$0.478

-

-

Overview

Enhance your consumer electronics projects with the TDA8200 by STMicroelectronics. Crafted with precision and expertise, this IC offers unparalleled quality and reliability. Its versatile applications in consumer circuits make it a must-have component for any design. With its innovative features and high performance, the TDA8200 delivers exceptional value and benefits to customers. Trust STMicroelectronics to provide you with cutting-edge solutions that elevate your products to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product suitable for consumer electronics that require portability and reliability.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy integration into electronic devices.

Power Supplies (V): 8.5

Operating at 8.5 volts provides a sufficient power supply for a variety of consumer electronic applications.

No. of Terminals: 28

Having 28 terminals allows for versatile connectivity options and compatibility with various circuit layouts.

Package Style (Meter): IN-LINE

The in-line package style provides a compact design that can be easily integrated into electronic assemblies.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, the product can withstand high heat conditions, ensuring reliable performance.

Minimum Operating Temperature: -25 °C

The product can operate in cold temperatures as low as -25 °C, making it suitable for a wide range of environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good conductivity and reliability in electrical connections.

Terminal Position: DUAL

Dual terminal positions enhance connectivity options and make it easier to integrate the product into circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer secure connections and ease of soldering during assembly.

Terminal Pitch: 2.54 mm

Having a terminal pitch of 2.54 mm allows for easy alignment and soldering of components on a standard PCB.

Technical Specifications

Other Function Consumer ICs TDA8200 attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e0

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

8.5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TDA8200 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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