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SPC5744BBK1AMMH2

NXP Semiconductors

SPC5744BBK1AMMH2 by NXP Semiconductors

NXP Semiconductors' SPC5744BBK1AMMH2 microcontroller features 32-bit architecture, 196608 bytes of RAM, and 1572864 ROM words. With a max clock frequency of 40 MHz, it is ideal for automotive applications requiring high-speed processing and extensive peripheral support like analog comparators, DMA, POR, RTC, RTI, timers (64), and WDT.

Median Price

$15.975

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 11,888 parts In-Stock

1+ parts

-

100+ parts

$14.200

1k+ parts

$12.710

10k+ parts

$11.960

11,888

-

$14.200

$12.710

$11.960

Verical

USA . 9,680 parts In-Stock

1+ parts

-

100+ parts

$17.750

1k+ parts

$15.887

10k+ parts

$14.950

9,680

-

$17.750

$15.887

$14.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,641 parts In-Stock

1+ parts

$14.991

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2,641

$14.991

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Vyrian

USA . 8,987 parts In-Stock

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8,987

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Anansix

USA . 1,788 parts In-Stock

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1,788

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Flip Electronics

USA . 880 parts In-Stock

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880

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,992 parts In-Stock

1+ parts

$13.410

100+ parts

-

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2,992

$13.410

-

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Corphita

USA . 3,984 parts In-Stock

1+ parts

$14.202

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3,984

$14.202

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AZTECH Wire

Italy . 368 parts In-Stock

1+ parts

$19.030

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368

$19.030

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Vigor

Singapore . 1,500 parts In-Stock

1+ parts

$30.330

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$30.330

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Aztec Data Supply Inc.

USA . 2,932 parts In-Stock

1+ parts

$45.790

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2,932

$45.790

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Microchip USA

USA . 2,765 parts In-Stock

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$48.642

100+ parts

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2,765

$48.642

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Corohmni

South Africa . 78 parts In-Stock

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$77.765

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78

$77.765

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Lixinc

USA . 10,398 parts In-Stock

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UNI Independent Distributors

Spain . 4,202 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Argo Parts USA

USA . 1,297 parts In-Stock

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1,297

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Continental Prestige Electronics

USA . 386 parts In-Stock

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386

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unlock the power of the SPC5744BBK1AMMH2 by NXP Semiconductors, a top-quality microcontroller designed for high-performance applications. With advanced features like integrated cache and numerous peripherals, this device offers unparalleled value to customers seeking reliability and efficiency. Manufactured by industry leader NXP Semiconductors, this microcontroller is versatile and robust, making it ideal for a wide range of projects. Experience the benefits of cutting-edge technology with the SPC5744BBK1AMMH2 and take your designs to the next level.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Durable and lightweight material for long-lasting performance.

Integrated Cache:

YES - Improved processing speed and efficiency.

Surface Mount:

YES - Easy installation and space-saving design.

Maximum Supply Voltage:

1.32 V - Energy-efficient operation for lower power consumption.

On Chip Data RAM Width:

8 - Provides ample storage for data processing tasks.

Screening Level:

ISO 26262 - Ensures high quality and reliability standards.

Package Shape:

SQUARE - Uniform shape for easy handling and mounting.

Bit Size:

32 - High processing capacity for complex applications.

No. of Terminals:

100 - Sufficient connectivity options for various functions.

Package Style (Meter):

GRID ARRAY, LOW PROFILE - Compact design for efficient space utilization.

Minimum Supply Voltage:

1.2 V - Performs reliably even at lower power levels.

Maximum Operating Temperature:

125 °C - Resilient to heat for consistent performance in challenging conditions.

CPU Family:

E200Z4 - Specific architecture optimized for specific tasks.

Minimum Operating Temperature:

40 °C - Reliable operation even in extreme cold environments.

Terminal Finish:

TIN SILVER - Corrosion-resistant finish for long-term durability.

ADC Channels:

YES - Allows for analog to digital conversion for versatile input options.

DMA Channels:

YES - Enhanced data transfer capabilities for efficient processing.

Terminal Position:

BOTTOM - Convenient layout for easy accessibility.

ROM Words:

1572864 - Large storage capacity for program and data storage.

Maximum Seated Height:

1.41 mm - Low profile design for space-constrained applications.

Width:

11 mm - Compact size for easy integration into various systems.

Data EEPROM Size:

65536 - Additional data storage for persistent information.

Boundary Scan:

YES - Facilitates testing and debugging for improved reliability.

Peripherals:

ANALOG COMPARATOR(3), DMA(32), POR, RTC, RTI, TIMER(64), WDT - Versatile peripherals for diverse functionality.

Maximum Clock Frequency:

40 MHz - High operating speed for fast data processing.

Maximum Time At Peak Reflow Temperature (s):

40 - Ensures proper soldering during assembly.

Peak Reflow Temperature °C:

260 - Withstands high temperatures during soldering processes.

Length:

11 mm - Compact dimensions for space-efficient installations.

Peripheral IC Type:

MICROCONTROLLER, RISC - Specialized integrated circuits for efficient processing.

No. of Timers:

64 - Multiple timing options for precision functions.

RAM Bytes:

196608 - Large memory capacity for efficient data storage and access.

Technology:

CMOS - Reliable and low-power consumption technology for optimal performance.

Terminal Form:

BALL - Secure connection points for reliable operation.

Analog To Digital Convertors:

31-Ch 12-Bit, 68-Ch 10-Bit - Provides versatile analog input options for different sensors and devices.

Maximum Supply Current:

264 mA - Efficient power usage for extended battery life.

Nominal Supply Voltage:

1.25 V - Stable voltage supply for consistent performance.

No. of DMA Channels:

32 - Multiple DMA channels for efficient data transfer.

Connectivity:

DSPI(4), FLEXCAN, I2C(4), I2S(3), SAI(3), SPI(4) - Diverse communication options for versatile connectivity.

ROM Programmability:

FLASH - Programmable memory for flexible application development.

Terminal Pitch:

1 mm - Standard spacing for easy connection compatibility.

Format:

FLOATING POINT - Enhanced precision for mathematical calculations.

Moisture Sensitivity Level (MSL):

3 - Resistant to moisture for reliable performance in various environments.

Speed:

120 rpm - Processing speed suitable for a wide range of applications.

Low Power Mode:

YES - Energy-efficient mode for extended battery life.

On Chip Program ROM Width:

8 - Embedded memory for quick access to program data.

No. of I/O Lines:

65 - Sufficient input and output options for versatile connectivity.

Technical Specifications

Microcontrollers SPC5744BBK1AMMH2 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e2

Length:

11 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

1

No. of I/O Lines:

65

No. of Terminals:

100

No. of Timers:

64

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

196608

ROM Words:

1572864

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.41 mm

Speed:

120 rpm

Maximum Supply Current:

264 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

11 mm

Peripheral IC Type:

Data EEPROM Size:

65536

Connectivity:

DSPI(4), FLEXCAN, I2C(4), I2S(3), SAI(3), SPI(4)

Peripherals:

ANALOG COMPARATOR(3), DMA(32), POR, RTC, RTI, TIMER(64), WDT

Analog To Digital Convertors:

31-Ch 12-Bit, 68-Ch 10-Bit

Trade Compliance

SPC5744BBK1AMMH2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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