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SPC5604CK0VLL6R

NXP Semiconductors

SPC5604CK0VLL6R by NXP Semiconductors

NXP Semiconductors' SPC5604CK0VLL6R microcontroller features 32-bit architecture, 8 MHz clock frequency, and 79 I/O lines. Ideal for applications requiring PWM channels, ADC channels, and a max supply voltage of 5.5 V. Commonly used in automotive systems due to its RISC-based design and low-profile square package shape.

Median Price

$10.200

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 311 parts In-Stock

1+ parts

$10.200

100+ parts

$10.000

1k+ parts

$9.790

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311

$10.200

$10.000

$9.790

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Flip Electronics (Authorized)

USA . 4,000 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 3,771 parts In-Stock

1+ parts

$9.690

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3,771

$9.690

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Nova Conductors

Japan . 34 parts In-Stock

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$13.238

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34

$13.238

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Vyrian

USA . 4,807 parts In-Stock

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4,807

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Flip Electronics

USA . 4,000 parts In-Stock

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Anansix

USA . 2,294 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,017 parts In-Stock

1+ parts

$8.670

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2,017

$8.670

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Corphita

USA . 511 parts In-Stock

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$9.180

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511

$9.180

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Vigor

Singapore . 287 parts In-Stock

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$11.360

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287

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Netroflash

USA . 100 parts In-Stock

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$13.238

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100

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AZTECH Wire

Italy . 234 parts In-Stock

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$15.480

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234

$15.480

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Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$40.569

100+ parts

$40.163

1k+ parts

$38.540

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300

$40.569

$40.163

$38.540

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Microchip USA

USA . 2,777 parts In-Stock

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$41.629

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$41.629

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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UNI Independent Distributors

Spain . 2,532 parts In-Stock

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Overview

Unleash the power of innovation with the SPC5604CK0VLL6R by NXP Semiconductors. This cutting-edge microcontroller is designed to revolutionize your projects, offering unparalleled performance and reliability. With a wide range of applications in automotive, industrial, and consumer electronics, this product provides exceptional value and flexibility. Experience the seamless integration and high-quality design that only NXP Semiconductors can deliver. Elevate your creations to new heights with the SPC5604CK0VLL6R.

Feature Benefit Bullets

Surface Mount: YES

Surface mount feature allows for easier PCB assembly and space-saving design.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of power options and compatibility.

Package Shape: SQUARE

Square package shape helps in efficient layout and space utilization on the PCB.

Bit Size: 32

32-bit architecture enables higher processing capabilities and performance.

No. of Terminals: 100

Provides ample connectivity options for peripherals and external devices.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, fine pitch package style ensures compactness and ease of integration in tight spaces.

Minimum Supply Voltage: 4.5 V

Allows for operation in lower voltage conditions without sacrificing performance.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and reliability in various operating environments.

ADC Channels: YES

Built-in ADC channels for analog inputs enable precise measurements and sensor integration.

Terminal Position: QUAD

Quad terminal position offers stability and connectivity for the device on the PCB.

Width: 14 mm

Compact width size allows for flexibility in board layout and space-constrained designs.

Maximum Clock Frequency: 8 MHz

High clock frequency enables fast processing and real-time operations.

Maximum Time At Peak Reflow Temperature (s): 40

Can sustain peak reflow temperatures for a sufficient duration during manufacturing processes.

Peak Reflow Temperature °C: 260

Withstands high peak reflow temperature for robust soldering and assembly.

Length: 14 mm

Compact length size for efficient use of board space and system integration.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller enables efficient data processing and control capabilities.

Terminal Form: GULL WING

Gull wing terminal form offers secure connections and reliable soldering points.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage for broad compatibility with existing systems and components.

PWM Channels: YES

PWM channels support precise control and modulation of output signals for various applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for dense packing and higher terminal count in a small footprint.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the device can withstand moderate exposure to moisture during storage and handling.

Speed: 64 rpm

Operates at a moderate speed of 64 rotations per minute for controlled and efficient performance.

No. of I/O Lines: 79

Provides a high number of I/O lines for versatile interfacing and connectivity options with external devices.

Technical Specifications

Microcontrollers SPC5604CK0VLL6R attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8 MHz

DMA Channels:

NO

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

79

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Speed:

64 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC5604CK0VLL6R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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