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SPC5604CK0CLL6

NXP Semiconductors

SPC5604CK0CLL6 by NXP Semiconductors

NXP Semiconductors' SPC5604CK0CLL6 microcontroller features 32-bit architecture, 100 terminals, and 8 MHz clock frequency. Ideal for automotive applications due to its ADC channels, PWM support, and RISC-based design.

Median Price

$11.833

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 38 parts In-Stock

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$11.833

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38

$11.833

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Digiode

USA . 4,621 parts In-Stock

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Vyrian

USA . 4,568 parts In-Stock

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4,568

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Anansix

USA . 414 parts In-Stock

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414

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Distributors (Availability)

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Netroflash

USA . 1,000 parts In-Stock

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$11.833

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1,000

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One Stop Electronics

USA . 394 parts In-Stock

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$12.000

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394

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AZTECH Wire

Italy . 448 parts In-Stock

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$13.038

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Vigor

Singapore . 2,311 parts In-Stock

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$19.250

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Ampacity Inc.

Singapore . 494 parts In-Stock

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$35.000

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Microchip USA

USA . 1,896 parts In-Stock

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$40.258

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Corphita

USA . 3,843 parts In-Stock

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UNI Independent Distributors

Spain . 3,553 parts In-Stock

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Overview

Unleash the power of innovation with the SPC5604CK0CLL6 by NXP Semiconductors. As a leader in the industry, NXP delivers top-quality microcontrollers that redefine possibilities. Ideal for a wide range of applications, this product offers unmatched value and benefits to customers seeking innovative solutions. Experience the advantages of cutting-edge technology and unleash your creativity with the SPC5604CK0CLL6.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design, making this microcontroller suitable for compact electronic devices.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage of 5.5 V, this microcontroller can handle a wide range of power inputs, making it versatile for various applications.

Package Shape: SQUARE

The square package shape provides stability and ease of mounting, ensuring secure placement on circuit boards.

Bit Size: 32

A 32-bit architecture allows for high-performance processing and efficient operation of the microcontroller, making it suitable for complex tasks.

No. of Terminals: 100

With a high number of terminals, this microcontroller offers plenty of connectivity options for interfacing with other components or peripherals.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels enables the microcontroller to process analog signals, making it ideal for sensor interfacing and data acquisition applications.

Peripheral IC Type: MICROCONTROLLER, RISC

A Reduced Instruction Set Computing (RISC) architecture provides efficient and streamlined operation, enhancing the performance and energy efficiency of the microcontroller.

PWM Channels: YES

Pulse Width Modulation (PWM) channels allow for precise control of analog outputs, enabling the microcontroller to drive motors, LEDs, and other devices with varying levels of power.

Technical Specifications

Microcontrollers SPC5604CK0CLL6 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8 MHz

DMA Channels:

NO

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

79

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Speed:

64 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC5604CK0CLL6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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