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SPC5604CAVLL6R

NXP Semiconductors

SPC5604CAVLL6R by NXP Semiconductors

NXP Semiconductors' SPC5604CAVLL6R is a 32-bit microcontroller with 100 terminals, operating at 8 MHz clock frequency. It features ADC and PWM channels, suitable for applications requiring low-profile square packages with fine pitch. Ideal for RISC-based peripheral ICs needing high-speed processing and multiple I/O lines.

Median Price

$11.923

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 4,000 parts In-Stock

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Nova Conductors

Japan . 700 parts In-Stock

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$11.923

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700

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Vyrian

USA . 6,091 parts In-Stock

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Flip Electronics

USA . 4,000 parts In-Stock

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Digiode

USA . 1,397 parts In-Stock

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Anansix

USA . 1,246 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,546 parts In-Stock

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$9.000

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AZTECH Wire

Italy . 543 parts In-Stock

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$13.170

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Vigor

Singapore . 1,131 parts In-Stock

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$18.975

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Microchip USA

USA . 1,933 parts In-Stock

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$37.492

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UNI Independent Distributors

Spain . 8,016 parts In-Stock

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Corphita

USA . 1,877 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$11.684

1k+ parts

$11.326

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$11.088

1,000

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$11.684

$11.326

$11.088

Overview

Unleash the power of innovation with the SPC5604CAVLL6R by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality microcontrollers that are guaranteed to elevate your projects to new heights. With a wide range of applications in various industries, this microcontroller offers unmatched value, benefits, and advantages to customers seeking reliable performance and advanced functionality. Say goodbye to limitations and hello to endless possibilities with the SPC5604CAVLL6R.

Feature Benefit Bullets

Surface Mount: YES

Ease of assembly and compact design makes it suitable for SMT applications.

Maximum Supply Voltage: 5.5 V

Ability to support higher voltage applications.

Package Shape: SQUARE

Square shape allows for efficient use of PCB space.

Bit Size: 32

Higher bit size allows for processing more data at a time.

No. of Terminals: 100

Sufficient number of terminals for various connections and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Compact and low profile size with fine pitch for space-saving designs.

Minimum Supply Voltage: 4.5 V

Wide range of supply voltage compatibility for versatility.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance.

ADC Channels: YES

Built-in ADC channels for analog inputs for sensor interfacing.

Terminal Position: QUAD

Quad terminal position for stable connections and improved signal integrity.

Width: 14 mm

Compact width for space-saving PCB layout.

Maximum Clock Frequency: 8 MHz

High clock frequency for fast processing and response times.

Maximum Time At Peak Reflow Temperature (s): 40

Adequate time at peak reflow temperature for reliable soldering.

Peak Reflow Temperature °C: 260

High peak reflow temperature for durable solder joints.

Length: 14 mm

Compact length for space-saving designs.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC microcontroller architecture for efficient data processing.

Terminal Form: GULL WING

Gull wing terminal form for reliable solder joints.

Nominal Supply Voltage: 5 V

Standard supply voltage for compatibility with various systems.

PWM Channels: YES

Built-in PWM channels for precise control of actuators.

Terminal Pitch: 0.5 mm

Fine terminal pitch for increased density and compactness.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates suitable moisture resistance for typical storage conditions.

Speed: 64 rpm

Speed value relevant for specific applications such as motor control.

No. of I/O Lines: 79

Sufficient number of I/O lines for interfacing with external devices.

Technical Specifications

Microcontrollers SPC5604CAVLL6R attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8 MHz

DMA Channels:

NO

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

79

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Speed:

64 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC5604CAVLL6R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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