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SPC5603BK0VLH4

NXP Semiconductors

SPC5603BK0VLH4 by NXP Semiconductors

MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40;

Median Price

$9.943

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$9.943

10k+ parts

-

9,600

-

-

$9.943

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,912 parts In-Stock

1+ parts

$16.131

100+ parts

-

1k+ parts

-

10k+ parts

-

3,912

$16.131

-

-

-

Vyrian

USA . 7,628 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,628

-

-

-

-

Anansix

USA . 2,071 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,071

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 450 parts In-Stock

1+ parts

$15.110

100+ parts

-

1k+ parts

-

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450

$15.110

-

-

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Corphita

USA . 4,413 parts In-Stock

1+ parts

$15.282

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-

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4,413

$15.282

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Component Stockers USA

USA . 1,184 parts In-Stock

1+ parts

$16.590

100+ parts

$11.190

1k+ parts

-

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1,184

$16.590

$11.190

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Microchip USA

USA . 2,424 parts In-Stock

1+ parts

$46.620

100+ parts

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2,424

$46.620

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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UNI Independent Distributors

Spain . 5,452 parts In-Stock

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5,452

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Technical Specifications

Microcontrollers SPC5603BK0VLH4 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

SPC5603BK0VLH4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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