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SPC5602BK0MLH4

NXP Semiconductors

SPC5602BK0MLH4 by NXP Semiconductors

NXP Semiconductors' SPC5602BK0MLH4 microcontroller features 32-bit architecture, 262144 ROM words, and 12-Ch 10-Bit ADC channels. Ideal for applications requiring low power mode, it offers connectivity options like CAN(2), I2C, SCI(3), SPI(2) and peripherals such as RTC and timers.

Median Price

$6.792

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 734 parts In-Stock

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$6.792

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Flip Electronics (Authorized)

USA . 750 parts In-Stock

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750

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Digiode

USA . 2,195 parts In-Stock

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$6.452

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Nova Conductors

Japan . 85 parts In-Stock

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$10.244

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Vyrian

USA . 3,182 parts In-Stock

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Flip Electronics

USA . 750 parts In-Stock

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750

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Anansix

USA . 607 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 342 parts In-Stock

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$5.770

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Corphita

USA . 1,192 parts In-Stock

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$6.113

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Continental Prestige Electronics

USA . 3,367 parts In-Stock

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$10.244

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$10.039

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Netroflash

USA . 50 parts In-Stock

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$9.732

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$9.527

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Vigor

Singapore . 5,187 parts In-Stock

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$14.910

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AZTECH Wire

Italy . 383 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 25,231 parts In-Stock

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Authorized Procurement Solutions

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UNI Independent Distributors

Spain . 5,776 parts In-Stock

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Microchip USA

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Argo Parts USA

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Overview

Unleash the power of cutting-edge technology with the SPC5602BK0MLH4 microcontroller by NXP Semiconductors. Boasting top-notch quality and reliability, this product offers unparalleled performance in a wide range of applications. Experience seamless connectivity, enhanced functionality, and superior efficiency with this innovative solution. Stay ahead of the curve and unlock endless possibilities with the SPC5602BK0MLH4. Elevate your projects to new heights and achieve remarkable results with this game-changing microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers due to its durability and reliability.

Surface Mount: YES

Surface mount technology allows for compact designs and easy assembly, making the product suitable for use in small devices.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power sources.

No. of Terminals: 64

Having a large number of terminals allows for more connectivity options and flexibility in design.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes this microcontroller suitable for use in various environmental conditions.

ADC Channels: YES

Analog to digital converters allow the microcontroller to interface with various sensors and input devices.

No. of Timers: 7

Multiple timers provide flexibility for time-sensitive operations and scheduling within the microcontroller.

Connectivity: CAN(2), I2C, SCI(3), SPI(2)

A variety of communication interfaces enable the microcontroller to easily communicate with other devices in a system.

Speed: 64 rpm

The speed of 64 rpm indicates the performance capabilities of the microcontroller for processing tasks efficiently.

Low Power Mode: YES

The availability of a low power mode helps in reducing power consumption and extending battery life in portable devices.

Technical Specifications

Microcontrollers SPC5602BK0MLH4 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z0

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

16

No. of I/O Lines:

45

No. of Serial I/Os:

5

No. of Terminals:

64

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

24576

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

65536

Connectivity:

CAN(2), I2C, SCI(3), SPI(2)

Peripherals:

RTC, TIMER(7), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

SPC5602BK0MLH4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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